Zobrazeno 1 - 10
of 40
pro vyhledávání: '"Chunlin Lv"'
Publikováno v:
Energy Reports, Vol 9, Iss , Pp 1073-1080 (2023)
Thermal interface materials (TIMs), as important materials for heat dissipation of insulated gate bipolar transistor (IGBT) modules, degrade under long-term thermal cycling, resulting in elevated junction temperatures and threatening the safe operati
Externí odkaz:
https://doaj.org/article/708efdb03dab4fae9ff62a151dcd82b3
Publikováno v:
Polyoxometalates, Vol 3, Iss 2, p 9140055 (2024)
Using chain-like polyethers consisting of two terminal –NH2 groups and (TBA)4[α-Mo8O26] as starting materials, two polyoxometalatocrown ethers were prepared by a cyclization reaction through the formation of Mo≡N triple bonds: (TBA)2[Mo6O17N(o-C
Externí odkaz:
https://doaj.org/article/c9c68d232653427788fd6ed4537aaa75
Publikováno v:
IEEE Access, Vol 8, Pp 149940-149951 (2020)
In the field of high voltage level applications, modular multi-level converter (MMC) has the definite advantages of low power loss and modularity and there have been many studies on its reliability. Some researches focus on the degradation of physica
Externí odkaz:
https://doaj.org/article/f72cfe1146f541f0a0bcd9886eca1e9c
Publikováno v:
IEEE Transactions on Power Electronics. 38:7674-7684
Publikováno v:
IEEE Transactions on Industrial Electronics. 70:1993-2002
Publikováno v:
IEEE Transactions on Industrial Electronics. 69:11283-11292
Power routing (PR) provides a good choice to improve the modular converter reliability by equalizing the lifetime among multi-cells. The existing PR strategies just equalize the lifetime of power semiconductor devices (PSDs) by routing lighter loads
Publikováno v:
2022 IEEE International Power Electronics and Application Conference and Exposition (PEAC).
Publikováno v:
IEEE Journal of Emerging and Selected Topics in Power Electronics. 9:4311-4319
Metallized film capacitor (MFC) is one of the key components in power electronic converters, accounting for a large proportion of failures. However, the time-varying external stress in long-term mission profile and time-varying internal stress due to
Publikováno v:
CPSS Transactions on Power Electronics and Applications. 6:115-126
The modular DC solid-state transformer (DC-SST) is promising but restricted by limited reliability, which can be solved by redundancy. However, current redundancy designs are only based on the reliability evaluation in stable operation condition and
Publikováno v:
Microelectronics Reliability. 138:114646