Zobrazeno 1 - 10
of 51
pro vyhledávání: '"Chungpaiboonpatana, S."'
Autor:
Hsu, D.T., Kim, H.K., Shi, F.G., Tong, H.Y., Chungpaiboonpatana, S., Davidson, C., Adams, J.M.
Publikováno v:
Microelectronics International: An International Journal, 2000, Vol. 17, Issue 1, pp. 22-27.
Externí odkaz:
http://www.emeraldinsight.com/doi/10.1108/13565360010305949
Publikováno v:
In Microelectronics Journal April 2000 31(4):271-275
Publikováno v:
In Materials Science in Semiconductor Processing 1999 2(4):309-319
Autor:
Shi, F.G *, Abdullah, Mikrajuddin, Chungpaiboonpatana, S, Okuyama, K, Davidson, C, Adams, J.M
Publikováno v:
In Materials Science in Semiconductor Processing 1999 2(3):263-269
Publikováno v:
2010 12th Electronics Packaging Technology Conference (EPTC); 2010, p114-119, 6p
Autor:
Chungpaiboonpatana, S., Shi, F.G.
Publikováno v:
Proceedings Electronic Components & Technology, 2005. ECTC '05; 2005, p954-958, 5p
Publikováno v:
2004 Proceedings 9th International Symposium on Advanced Packaging Materials: Processes, Properties & Interfaces (IEEE Cat. No.04TH8742); 2004, p38-44, 7p
Publikováno v:
2004 Proceedings 9th International Symposium on Advanced Packaging Materials: Processes, Properties & Interfaces (IEEE Cat. No.04TH8742); 2004, p31-37, 7p
Publikováno v:
2004 Proceedings 9th International Symposium on Advanced Packaging Materials: Processes, Properties & Interfaces (IEEE Cat. No.04TH8742); 2004, p51-56, 6p
Publikováno v:
Proceedings of SPIE; Nov2000, Issue 1, p202-210, 9p