Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Chung-Wen Ho"'
Autor:
Shang-Shing P. Chou, Chung-Wen Ho
Publikováno v:
Tetrahedron Letters. 46:8551-8554
3-Sulfolenes 1a – b underwent [4+2] cycloaddition reactions with p -toluenesulfonyl isocyanate to give tetrahydropyridinones 3a – b . Through N -detosylation of 3a – b and subsequent intramolecular cyclization, indolizidine 5a and quinolizidine
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ca833d9aaf52c8cd1e05bbffae59ea28
https://doi.org/10.1016/j.tetlet.2005.09.191
https://doi.org/10.1016/j.tetlet.2005.09.191
Publikováno v:
IEEE Transactions on Circuits & Systems; 1975, Vol. 22 Issue 6, p504-509, 6p
Publikováno v:
IEEE Transactions on Components, Hybrids & Manufacturing Technology; 1982, Vol. 5 Issue 4, p368-374, 7p
Autor:
Chung-Wen Ho
Publikováno v:
IEEE Transactions on Circuit Theory; 1971, Vol. 18 Issue 1, p114-122, 9p
Autor:
Chung-Wen Ho, Balabanian, N.
Publikováno v:
IEEE Transactions on Circuit Theory; 1967, Vol. 14 Issue 2, p118-128, 11p
Publikováno v:
IEEE Transactions on Components, Hybrids, and Manufacturing Technology. 5:368-374
An integrated capacitor substrate which is proposed as an essential part in the realization of a thin film module for high speed digital computing systems is discussed. Several innovative multilayer ceramic (MLC) concepts relative to the fabrication
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::58501e39b4ae34da0fd9913c312a47ee
https://doi.org/10.1109/tchmt.1982.1136005
https://doi.org/10.1109/tchmt.1982.1136005
Publikováno v:
IEEE Transactions on Circuits and Systems. 22:504-509
The nodal method has been widely used for formulating circuit equations in computer-aided network analysis and design programs. However, several limitations exist in this method including the inability to process voltage sources and current-dependent
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8ace1396d6862965a8b48d575191ca18
https://doi.org/10.1109/tcs.1975.1084079
https://doi.org/10.1109/tcs.1975.1084079
Publikováno v:
IBM Journal of Research and Development. 26:286-296
This paper discusses a multichip module for future VLSI computer packages on which an array of silicon chips is directly attached and interconnected by high-density thin-film lossy transmission lines. Since the high-performance VLSI chips contain a l
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cbaa0b0f2976b9db15971b96b4db7cac
https://doi.org/10.1147/rd.263.0286
https://doi.org/10.1147/rd.263.0286