Zobrazeno 1 - 10
of 53
pro vyhledávání: '"Chung-Hao Tsai"'
Publikováno v:
PLoS ONE, Vol 12, Iss 6, p e0179358 (2017)
Chronic exocrine pancreatic insufficiency can lead to osteoporosis. However, the incidence and risk of osteoporosis after acute inflammation of pancreas remained known. Thus, we conducted a population-based cohort study to clarify the association bet
Externí odkaz:
https://doaj.org/article/a5fcd413c5804fa78981309adf4cacee
Autor:
Chung-Hao Tsai, 蔡仲豪
100
An artificial coupled-line with broadband even-mode rejection is proposed based on the concept of transmission line metamaterial. It is composed of a pair of coupled lines and a ground plane backed by mushroom structures and called mushroom-
An artificial coupled-line with broadband even-mode rejection is proposed based on the concept of transmission line metamaterial. It is composed of a pair of coupled lines and a ground plane backed by mushroom structures and called mushroom-
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/v5r3yr
Autor:
Douglas C. H. Yu, Chuei-Tang Wang, Chia-Chia Lin, Chih-Hsin Lu, Gene Wu, Chien-Yuan Huang, Wei-Ting Chen, Terry Ku, Kuo-Chung Yee, Chung-Hao Tsai
Publikováno v:
IEEE Transactions on Electron Devices. 69:7167-7172
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::69e71667384550e2a7c2f15611448945
https://doi.org/10.1109/ted.2022.3205144
https://doi.org/10.1109/ted.2022.3205144
Autor:
Chuei-Tang Wang, Chia-Chai Lin, Chih-Hsin Lu, Wei-Ting Chen, Chung-Hao Tsai, Douglas C. H. Yu
Publikováno v:
2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::253478e8a7c877e90b06e4ee4651f102
https://doi.org/10.1109/vlsitechnologyandcir46769.2022.9830182
https://doi.org/10.1109/vlsitechnologyandcir46769.2022.9830182
Autor:
Wu Kai-Chiang, Chung-Hao Tsai, Tang Tzu-Chun, Doug C. H. Yu, Chung-Shi Liu, Che-Wei Hsu, Chuei-Tang Wang, Pu Han-Ping, Chia-Chia Lin, Lu Chun-Lin
Publikováno v:
2019 Electrical Design of Advanced Packaging and Systems (EDAPS).
High Q-factor (quality factor) 3D solenoid inductor formed by RDL (redistribution layer) and copper via in the molding compound on InFO package was fabricated. The effect of the turns and cross sectional area on Q-factor is discussed. The 3D solenoid
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1c5ab65c83e3becf688654525e1270b8
https://doi.org/10.1109/edaps47854.2019.9011648
https://doi.org/10.1109/edaps47854.2019.9011648
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
An advanced 3D Multi-stack (MUST) system integration technology, 3D MUST-in-MUST (3D-MiM) fan out package, has been developed as next generation wafer-level fan-out package technology. 3D-MiM technology utilizes a more simplified architecture which e
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9179c82bd8d41a53cade457fdeaddebb
https://doi.org/10.1109/ectc.2019.00008
https://doi.org/10.1109/ectc.2019.00008
Autor:
H. P. Pu, Chun-Wen Lin, Chung-Hao Tsai, Chuei-Tang Wang, Che-Wei Hsu, Jeng-Shien Hsieh, Tzu-Chun Tang, Douglas Yu, Wu Kai-Chiang
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
InFO_AiP technology, with low loss chip-to-antenna interconnect and wideband slot-coupled patch antenna, is proposed for low power, high performance, and compact 5G millimeter wave (mmWave) system integration. The low loss chip-to-antenna interconnec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2a306627f0e5e97727ae14971f2eae69
https://doi.org/10.1109/ectc.2018.00039
https://doi.org/10.1109/ectc.2018.00039
Publikováno v:
PLoS ONE
PLoS ONE, Vol 12, Iss 6, p e0179358 (2017)
PLoS ONE, Vol 12, Iss 6, p e0179358 (2017)
Purpose Chronic exocrine pancreatic insufficiency can lead to osteoporosis. However, the incidence and risk of osteoporosis after acute inflammation of pancreas remained known. Thus, we conducted a population-based cohort study to clarify the associa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::dc2078ce6ac0fab3ff876fd7ce54c27d
http://europepmc.org/articles/PMC5467899
http://europepmc.org/articles/PMC5467899
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
High performance millimeter wave passive devices are realized on smooth, fine pitch InFO redistribution layer (RDL). These passive devices are balun, power combiner, coupler, and microstrip line and the electrical performances are measured from 0.1GH
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8cd55af144e168914b0d92d67d29adb1
https://doi.org/10.1109/ectc.2017.251
https://doi.org/10.1109/ectc.2017.251
Publikováno v:
IEEE Transactions on Microwave Theory and Techniques. 62:1647-1656
A new common-mode bandstop filter (CM-BSF) with an all-pass performance (from dc to 9 GHz) for differential signals is proposed by using a C-shaped patterned ground structure (PGS) with meandered signal lines on a two-layer printed circuit board (PCB
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b8290556fa765c411ebdc51a275f5d9f
https://doi.org/10.1109/tmtt.2014.2328314
https://doi.org/10.1109/tmtt.2014.2328314