Zobrazeno 1 - 10
of 26
pro vyhledávání: '"Chung-En Tsai"'
Autor:
Yu-Rui Chen, Bo-Wei Huang, Chun-Yi Cheng, Wan-Hsuan Hsieh, Chung-En Tsai, Chien-Te Tu, Yi-Chun Liu, C. W. Liu
Publikováno v:
IEEE Transactions on Electron Devices. 69:3611-3616
Autor:
Chien-Te Tu, Wan-Hsuan Hsieh, Bo-Wei Huang, Yu-Rui Chen, Yi-Chun Liu, Chung-En Tsai, Shee-Jier Chueh, C. W. Liu
Publikováno v:
IEEE Electron Device Letters. 43:682-685
Autor:
Bo-Wei Huang, Chung-En Tsai, Yi-Chun Liu, Chien-Te Tu, Wan-Hsuan Hsieh, Sun-Rong Jan, Yu-Rui Chen, Shee-Jier Chueh, Chun-Yi Cheng, C. W. Liu
Publikováno v:
IEEE Transactions on Electron Devices. 69:2130-2136
Autor:
Yi-Chun Liu, Jyun-Yan Chen, Shee-Jier Chueh, Bo-Wei Huang, Chung-En Tsai, Chun-Yi Cheng, Chien-Te Tu, C. W. Liu
Publikováno v:
IEEE Transactions on Electron Devices. 68:6599-6604
The eight stacked Ge $_{0.75}$ Si $_{0.25}$ nanosheets, the seven stacked Ge $_{0.95}$ Si $_{0.05}$ nanowires, and the six stacked Ge $_{0.95}$ Si $_{0.05}$ nanowires without parasitic channels are demonstrated. These highly stacked channels are made
Autor:
Chien-Te Tu, Yi-Chun Liu, Bo-Wei Huang, Yu-Rui Chen, Wan-Hsuan Hsieh, Chung-En Tsai, Shee-Jier Chueh, Chun-Yi Cheng, Yichen Ma, C. W. Liu
Publikováno v:
2022 International Electron Devices Meeting (IEDM).
Autor:
Chung-En Tsai, Chun-Yi Cheng, Bo-Wei Huang, Hsin-Cheng Lin, Tao Chou, Chien-Te Tu, Yi-Chun Liu, Sun-Rong Jan, Yu-Rui Chen, Wan-Hsuan Hsieh, Kung-Ying Chiu, Shee-Jier Chueh, C. W. Liu
Publikováno v:
2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits).
Autor:
Chien-Te Tu, C. W. Liu, Fang-Liang Lu, Hung-Yu Ye, Jyun-Yan Chen, Yu-Shiang Huang, Chung-En Tsai, Chun-Yi Cheng
Publikováno v:
IEEE Transactions on Electron Devices. 68:2071-2076
The undoped 4-stacked Ge0.9Sn0.1 nanosheets sandwiched by double Ge0.95Sn0.05 caps without parasitic Ge channels underneath are realized by a radical-based highly selective isotropic dry etching. Highly inter-channel uniformity of the stacked GeSn na
Autor:
Chun-Yi Cheng, Wan-Hsuan Hsieh, Bo-Wei Huang, Yi-Chun Liu, Chien-Te Tu, Chung-En Tsai, Shee-Jier Chueh, Guan-Hua Chen, C. W. Liu
Publikováno v:
2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA).
Publikováno v:
IEEE Transactions on Electron Devices. 67:5053-5058
The low contact resistivity with the median value of $3.1\times 10^{-{9}}\,\,\Omega \cdot \text {cm}^{{2}}$ (the lowest value of $1.1\times 10^{-{9}}\,\,\Omega \cdot \text {cm}^{{2}}$ ) is achieved by Ti metal contact to in-situ B-doped GeSn with B s
Autor:
Chung-En Tsai, Yi-Chun Liu, Chien-Te Tu, Bo-Wei Huang, Sun-Rong Jan, Yu-Rui Chen, Jyun-Yan Chen, Shee-Jier Chueh, Chun-Yi Cheng, Chia-Jung Tsen, Yichen Ma, C. W. Liu
Publikováno v:
2021 IEEE International Electron Devices Meeting (IEDM).