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pro vyhledávání: '"Chung H. Jeon"'
Autor:
Jianshe Tang, Jung Ho Han, Chung H. Jeon, Sung Won Park, Bo Xie, Wei Lu, Z Fred Li, Ven Subbaraman, Kent Child, Roman Gouk, Jason Wright, James S. Papanu
Publikováno v:
ECS Transactions. 11:117-122
As the technology node scales down to 45nm and beyond, removal of particles and metal contamination from wafer backsides have become critical for advanced lithography with smaller depth of focus, as well as to enable efficient metrology tool sharing
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::54fa2abd6538df86b9330e5bd79d0c08
https://doi.org/10.1149/1.2779370
https://doi.org/10.1149/1.2779370
