Zobrazeno 1 - 8 of 8 pro vyhledávání: '"Chundong Zhao"'
1
Akademický článek
A Light-Weighted CNN Model for Wafer Structural Defect Detection
Autor: Xiaoyan Chen, Jianyong Chen, Xiaoguang Han, Chundong Zhao, Dongyang Zhang, Kuifeng Zhu, Yanjie Su
Publikováno v: IEEE Access, Vol 8, Pp 24006-24018 (2020)
Silicon wafer is the raw material of semiconductor chip. It is important and challenging to research a fast and accurate method of identifying and classifying wafer structural defects. To this end, we present a novel detection method in terms of the
Externí odkaz: https://doaj.org/article/ffab78bee6bb47ae9b7d9ee117b7289c
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3
Predicting the Lithium-Vacancy Arrangements of Layered Cathode Materials by a Voronoi Finite Element Method
Autor: Chundong Zhao, Feng Zheng, Dexin Zhang, Yiwei You, Shunqing Wu
Publikováno v: Journal of The Electrochemical Society. 170:050504
We proposed a Voronoi finite element (VFE) method to determine the possible intermediate phases of cathode materials of Li-ion batteries (LIBs). Lithium-vacancy arrangements can be accurately predicted based on Voronoi polyhedra centered on lithium i
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::28315ed1ebd57a1184f34dcb1f7c945b
https://doi.org/10.1149/1945-7111/accf3b
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6
K-means clustering with morphological filtering for silicon wafer grain defect detection
Autor: Chundong Zhao, Dongyang Zhang, Jianyong Chen, Xiaoyan Chen, Yanjie Su, Kuifeng Zhu
Publikováno v: 2020 IEEE 4th Information Technology, Networking, Electronic and Automation Control Conference (ITNEC).
Grain surface defects have become an important factor affecting chip quality. How to correctly detect grain surface defects is a complicated and challenging task. Defect detection technology has become a key technology in the chip industry. K-means c
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::a5f28a4138d0f2f0e3934269c5be5c49
https://doi.org/10.1109/itnec48623.2020.9084726
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7
A compact Robot-based defect detection device design for silicon wafer
Autor: Kuifeng Zhu, Jianyong Chen, Chundong Zhao, Dongyang Zhang, Xiaoyan Chen, Yanjie Su
Publikováno v: Journal of Physics: Conference Series. 1449:012111
With the development of semiconductor chips manufacturing, the quality of chips are required to a higher level. At present, as a key element of chip produce process, wafer surface defect detection is a hard challenge for operators, as manual detectio
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::88fdb1f90ba2be72ce5e111a8d2d1425
https://doi.org/10.1088/1742-6596/1449/1/012111
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8
Akademický článek
A compact Robot-based defect detection device design for silicon wafer.
Autor: Xiaoyan Chen, Chundong Zhao, Jianyong Chen, Dongyang Zhang, Kuifeng Zhu, Yanjie Su
Publikováno v: Journal of Physics: Conference Series; 2020, Vol. 1449 Issue 1, p1-1, 1p
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