Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Chundong Zhao"'
Autor:
Xiaoyan Chen, Jianyong Chen, Xiaoguang Han, Chundong Zhao, Dongyang Zhang, Kuifeng Zhu, Yanjie Su
Publikováno v:
IEEE Access, Vol 8, Pp 24006-24018 (2020)
Silicon wafer is the raw material of semiconductor chip. It is important and challenging to research a fast and accurate method of identifying and classifying wafer structural defects. To this end, we present a novel detection method in terms of the
Externí odkaz:
https://doaj.org/article/ffab78bee6bb47ae9b7d9ee117b7289c
Autor:
Yiwei You, Feng Zheng, Dexin Zhang, Chundong Zhao, Chunhua Hu, Xinrui Cao, Zi-zhong Zhu, Shunqing Wu
Publikováno v:
ACS Applied Energy Materials. 5:15078-15085
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::74330deb1595b61b53daf010ec5f4084
https://doi.org/10.1021/acsaem.2c02756
https://doi.org/10.1021/acsaem.2c02756
Publikováno v:
Journal of The Electrochemical Society. 170:050504
We proposed a Voronoi finite element (VFE) method to determine the possible intermediate phases of cathode materials of Li-ion batteries (LIBs). Lithium-vacancy arrangements can be accurately predicted based on Voronoi polyhedra centered on lithium i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::28315ed1ebd57a1184f34dcb1f7c945b
https://doi.org/10.1149/1945-7111/accf3b
https://doi.org/10.1149/1945-7111/accf3b
Publikováno v:
Proceedings of International Conference on Artificial Life and Robotics. 25:795-799
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5fffd706be37b45f7d75424b8fa5c376
https://doi.org/10.5954/icarob.2020.os15-2
https://doi.org/10.5954/icarob.2020.os15-2
Publikováno v:
Proceedings of International Conference on Artificial Life and Robotics. 25:791-794
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::86e8d7a33c5c75a33e6f5f986b39024e
https://doi.org/10.5954/icarob.2020.os15-1
https://doi.org/10.5954/icarob.2020.os15-1
Publikováno v:
2020 IEEE 4th Information Technology, Networking, Electronic and Automation Control Conference (ITNEC).
Grain surface defects have become an important factor affecting chip quality. How to correctly detect grain surface defects is a complicated and challenging task. Defect detection technology has become a key technology in the chip industry. K-means c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a5f28a4138d0f2f0e3934269c5be5c49
https://doi.org/10.1109/itnec48623.2020.9084726
https://doi.org/10.1109/itnec48623.2020.9084726
Publikováno v:
Journal of Physics: Conference Series. 1449:012111
With the development of semiconductor chips manufacturing, the quality of chips are required to a higher level. At present, as a key element of chip produce process, wafer surface defect detection is a hard challenge for operators, as manual detectio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::88fdb1f90ba2be72ce5e111a8d2d1425
https://doi.org/10.1088/1742-6596/1449/1/012111
https://doi.org/10.1088/1742-6596/1449/1/012111
Publikováno v:
Journal of Physics: Conference Series; 2020, Vol. 1449 Issue 1, p1-1, 1p
Publikováno v:
Petroleum Geology & Recovery Efficiency. 2021, Vol. 28 Issue 6, p129-134. 6p.