Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Chun-Tai Wang"'
Autor:
Chun-Tai Wang, 王俊泰
100
Humanity since the Industrial Revolution,because economyical quick take-off. but to supply the electricity consumption urgent demand, therefore the power plant expands continually, in addition other industries and so on massive combustion co
Humanity since the Industrial Revolution,because economyical quick take-off. but to supply the electricity consumption urgent demand, therefore the power plant expands continually, in addition other industries and so on massive combustion co
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/85447542746915611634
Publikováno v:
Rice Science, Vol 17, Iss 3, Pp 185-191 (2010)
In order to reveal the origin and evolutionary relationship between two CCDD genome species, Oryza alta and Oryza latifolia, fluorescence in situ hybridization (FISH) was adopted to analyze the genomes of the two species with C0t-1 DNA from O. alta a
Publikováno v:
2007 International Microsystems, Packaging, Assembly and Circuits Technology.
A compact and thin WiFi SiP module using IPD (Integrated Passive Device) technology is proposed. The WiFi SiP module integrates WiFi single chip, RF front end, EEPROM, and IPD chip as a full system module that can be easily used for 802.11b/g WLAN ap
Publikováno v:
Yi chuan = Hereditas. 27(3)
The RAPD analysis was conducted on genome DNA from 21 sets of rice, including 6 three-line hybrid rice combinations, separately derived from three different kinds of cytoplasmic male sterile (CMS) lines and their related parents. Out of 264 random pr
Autor:
Xin-Qiong Liu1, Jing-Luan Wei1, Ji-Cheng Zhang1, Chun-Tai Wang1, Xue-Qun Liu1, Xiang-Ming Zhang1, Ling Wang2, Qing-Hua Pan2 panqh@scau.edu.cn
Publikováno v:
International Journal of Plant Sciences. Nov2011, Vol. 172 Issue 8, p970-979. 10p.
Autor:
Xin-Qiong Liu1, Ling Wang2 panqh@scau.edu.cn, Xiang-Dong Liu3, Xue-Qun Liu1, De-Bin Wang1, Chun-Tai Wang1, Fei Lin2, Qing-Hua Pany2
Publikováno v:
International Journal of Plant Sciences. Mar2010, Vol. 171 Issue 3, p235-243. 9p. 3 Diagrams, 4 Charts, 1 Graph.
Publikováno v:
2007 International Microsystems, Packaging, Assembly & Circuits Technology; 2007, p146-148, 3p