Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Chun-Huang Yu"'
Autor:
Chun-Huang Yu, 尤俊煌
91
The material characterizations of various TiO2-SiO2 composite oxide thin films prepared with low pressure chemical vapor deposition, using titanium tetra-iso-propoxide(TTIP) and tetraethoxysilane(TEOS) as precursors, before and after annealin
The material characterizations of various TiO2-SiO2 composite oxide thin films prepared with low pressure chemical vapor deposition, using titanium tetra-iso-propoxide(TTIP) and tetraethoxysilane(TEOS) as precursors, before and after annealin
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/24578557708418187908
Autor:
Wei-Da Guo, Chun-Huang Yu, Tzong-Lin Wu, Yi-Chang Lu, Yung-Shou Cheng, Ming-Zhang Hong, Joseph Ku, Ruey-Beei Wu, Hsin-Shu Chen, Hao-Hsiang Chuang, Wen-Chang Cheng, Yu-Hsiang Lin, Yen-Ping Chou, Chuan-Jen Chang
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility. 52:381-391
Under the platform of a high-speed double-data-rate three (DDR3) memory module, a modeling method considering all the significant effects from the chip, package, and board levels is developed to identify and investigate the critical nets affecting th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::009ef9adf43c395c7b8ed5c712c13e3d
https://doi.org/10.1109/temc.2010.2043108
https://doi.org/10.1109/temc.2010.2043108
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility. 52:235-239
Based on two-port measurements, a distributed compact model and an extraction method for the power bus of a high-speed memory chip are proposed. The 1-D model is constructed according to the relative locations of the power and ground pads on the chip
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1096a88a55d316a9ed761c57df2d914d
https://doi.org/10.1109/temc.2009.2035614
https://doi.org/10.1109/temc.2009.2035614
Publikováno v:
2008 Electrical Design of Advanced Packaging and Systems Symposium.
In this paper, a complete simulation methodology is introduced to analyze the signal integrity in a double data rate (DDR3) high-speed memory module. The equivalent models of the first-level package and various discontinuities in printed circuit boar
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f81e24c701a777e56e42441e65a03968
https://doi.org/10.1109/edaps.2008.4736009
https://doi.org/10.1109/edaps.2008.4736009
Publikováno v:
2008 Electrical Design of Advanced Packaging & Systems Symposium; 2008, p101-104, 4p
Autor:
Hao-Hsiang Chuang, Wei-Da Guo, Yu-Hsiang Lin, Hsin-Shu Chen, Yi-Chang Lu, Yung-Shou Cheng, Ming-Zhang Hong, Chun-Huang Yu, Wen-Chang Cheng, Yen-Ping Chou, Chuan-Jen Chang, Ku, Joseph, Tzong-Lin Wu, Ruey-Beei Wu
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility; May2010, Vol. 52 Issue 2, p381-391, 11p
Autor:
Hao-Hsiang Chuang, Chih-Jung Hsu, Jacky Hong, Chun-Huang Yu, Argy Cheng, Ku, Joseph, Tzong-Lin Wu
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility; Feb2010, Vol. 52 Issue 1, p235-239, 5p