Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Chun Lei Xie"'
Publikováno v:
Advanced Materials Research. :721-724
A laboratory ice-breaking test was employed for an asphalt pavement with different dosage of rubber crumbs to study the ice-breaking effects by a self-developed road ice-breaking simulating tester. The mesoscopic model of rubber crumbs asphalt paveme
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::152618b547ba8b4d92d36785cfb30d2f
https://doi.org/10.4028/www.scientific.net/amr.1065-1069.721
https://doi.org/10.4028/www.scientific.net/amr.1065-1069.721
Publikováno v:
ECS Transactions. 18:367-372
This paper presents a new method of Inverse Lithography Technology (ILT) to accelerate its optimization process and convergence, which involves two steps in iteration: the first step is to find hot-spots in the layout in the optimization process and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::18f7d64f04d378afeb8a8a11a4e68d83
https://doi.org/10.1149/1.3096473
https://doi.org/10.1149/1.3096473
Publikováno v:
Proteome Science, Vol 10, Iss 1, p 15 (2012)
Proteome Science
Proteome Science
Background Diabetes can lead to serious microvascular complications such as proliferative diabetic retinopathy (PDR), which results in severe vision loss. The diabetes-induced alterations in the vitreous protein composition in diabetic patients with
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::693572c5989a261a05e4d1f69a03493d
http://www.proteomesci.com/content/10/1/15
http://www.proteomesci.com/content/10/1/15
Publikováno v:
2006 8th International Conference on Solid-State and Integrated Circuit Technology Proceedings.
A new efficient OPC model calibration method for optical lithography process is presented. The method is based on the applying of circle-sampling theorem in the description of mask and optical system. A new point intensity calculation method is then
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::87676d37a3610a5ee08de15fbf753c9b
https://doi.org/10.1109/icsict.2006.306242
https://doi.org/10.1109/icsict.2006.306242
Publikováno v:
2006 8th International Conference on Solid-State & Integrated Circuit Technology Proceedings; 2006, pN.PAG, 1p