Zobrazeno 1 - 10
of 13
pro vyhledávání: '"Chun IY"'
Autor:
Li Z; University of Michigan - Shanghai Jiao Tong University Joint Institute, Shanghai Jiao Tong University, Shanghai, China., Long Y; University of Michigan - Shanghai Jiao Tong University Joint Institute, Shanghai Jiao Tong University, Shanghai, China., Chun IY; School of Electronic & Electrical Engineering and Department of Artificial Intelligence, Sungkyunkwan University, 2066 Seobu-ro, Jangan-gu, Suwon, Gyeonggi, 16419, Republic of Korea.
Publikováno v:
Medical physics [Med Phys] 2023 Apr; Vol. 50 (4), pp. 2195-2211. Date of Electronic Publication: 2022 Jul 10.
Publikováno v:
IEEE transactions on pattern analysis and machine intelligence [IEEE Trans Pattern Anal Mach Intell] 2023 Apr; Vol. 45 (4), pp. 4915-4931. Date of Electronic Publication: 2023 Mar 10.
Autor:
Zhang D; Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, MI, USA., Xu Z; Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, MI, USA., Huang Z; Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, MI, USA., Gutierrez AR; Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, MI, USA., Blocker CJ; Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, MI, USA., Liu CH; Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, MI, USA., Lien MB; Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, MI, USA., Cheng G; Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, MI, USA., Liu Z; Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, MI, USA., Chun IY; Department of Electrical Engineering, University of Hawai'i at Manoa, Honolulu, HI, USA. iychun@hawaii.edu., Fessler JA; Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, MI, USA. fessler@umich.edu., Zhong Z; Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, MI, USA. zzhong@umich.edu., Norris TB; Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, MI, USA. tnorris@umich.edu.
Publikováno v:
Nature communications [Nat Commun] 2021 Apr 23; Vol. 12 (1), pp. 2413. Date of Electronic Publication: 2021 Apr 23.
Publikováno v:
IEEE transactions on medical imaging [IEEE Trans Med Imaging] 2020 Nov; Vol. 39 (11), pp. 3512-3522. Date of Electronic Publication: 2020 Oct 28.
Autor:
Chun IY, Fessler JA
Publikováno v:
IEEE transactions on image processing : a publication of the IEEE Signal Processing Society [IEEE Trans Image Process] 2020; Vol. 29 (1), pp. 2108-2122. Date of Electronic Publication: 2019 Sep 02.
Autor:
Chun IY; Department of Electrical Engineering and Computer Science, The University of Michigan, Ann Arbor, MI 48019 USA., Hong D; Department of Electrical Engineering and Computer Science, The University of Michigan, Ann Arbor, MI 48019 USA., Adcock B; Department of Mathematics, Simon Fraser University, Burnaby, BC V5A 1S6 Canada., Fessler JA; Department of Electrical Engineering and Computer Science, The University of Michigan, Ann Arbor, MI 48019 USA.
Publikováno v:
IEEE signal processing letters [IEEE Signal Process Lett] 2019 Aug; Vol. 26 (8), pp. 1137-1141. Date of Electronic Publication: 2019 Jun 07.
Autor:
Jang I; School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN, United States of America. Electronic address: jibikbam@gmail.com., Chun IY; School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN, United States of America., Brosch JR; Department of Neurology, Indiana University School of Medicine, Indianapolis, IN, United States of America., Bari S; School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN, United States of America., Zou Y; Weldon School of Biomedical Engineering, Purdue University, West Lafayette, IN, United States of America; College of Veterinary Medicine, Purdue University, West Lafayette, IN, United States of America., Cummiskey BR; School of Mechanical Engineering, Purdue University, West Lafayette, IN, United States of America., Lee TA; School of Mechanical Engineering, Purdue University, West Lafayette, IN, United States of America., Lycke RJ; Weldon School of Biomedical Engineering, Purdue University, West Lafayette, IN, United States of America., Poole VN; Weldon School of Biomedical Engineering, Purdue University, West Lafayette, IN, United States of America., Shenk TE; School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN, United States of America., Svaldi DO; Weldon School of Biomedical Engineering, Purdue University, West Lafayette, IN, United States of America., Tamer GG Jr; Weldon School of Biomedical Engineering, Purdue University, West Lafayette, IN, United States of America., Dydak U; School of Health Sciences, Purdue University, West Lafayette, IN, United States of America., Leverenz LJ; Department of Health and Kinesiology, Purdue University, West Lafayette, IN, United States of America., Nauman EA; Weldon School of Biomedical Engineering, Purdue University, West Lafayette, IN, United States of America; School of Mechanical Engineering, Purdue University, West Lafayette, IN, United States of America; Department of Basic Medical Sciences, Purdue University, West Lafayette, IN, United States of America., Talavage TM; School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN, United States of America; Weldon School of Biomedical Engineering, Purdue University, West Lafayette, IN, United States of America.
Publikováno v:
NeuroImage. Clinical [Neuroimage Clin] 2019; Vol. 24, pp. 101930. Date of Electronic Publication: 2019 Jul 16.
Autor:
Chun IY, Fessler JA
Publikováno v:
IEEE transactions on image processing : a publication of the IEEE Signal Processing Society [IEEE Trans Image Process] 2018 Apr; Vol. 27 (4), pp. 1697-1712. Date of Electronic Publication: 2017 Oct 09.
Publikováno v:
IEEE transactions on medical imaging [IEEE Trans Med Imaging] 2016 Jan; Vol. 35 (1), pp. 354-68. Date of Electronic Publication: 2015 Aug 28.
Autor:
Chun IY; a School of Electrical and Computer Engineering , Purdue University , West Lafayette , Indiana., Mao X, Breedlove EL, Leverenz LJ, Nauman EA, Talavage TM
Publikováno v:
Developmental neuropsychology [Dev Neuropsychol] 2015; Vol. 40 (2), pp. 92-7.