Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Chun Ho Fan"'
Autor:
Katsuyuki Sakuma, Roy Yu, Michael Belyansky, Marc A Bergendahl, Juan-Manuel Gomez, Spyridon Skordas, John Knickerbocker, Dale McHerron, Ming Li, Yiu Ming Cheung, Siu Cheung So, So Ying Kwok, Chun Ho Fan, Siu Wing Lau
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0e9e73ef0437c5b113c48d69bc41d39f
https://doi.org/10.1109/ectc51906.2022.00058
https://doi.org/10.1109/ectc51906.2022.00058
Autor:
Yiu Ming Cheung, Juan-Manuel Gomez, Chun Ho Fan, Siu Wing Lau, Siu Cheung So, D. McHerron, Michael P. Belyansky, Marc Phaneuf, Isabel de Sousa, Katsuyuki Sakuma, Spyridon Skordas, Dishit P. Parekh, So Ying Kwok, Ming Li, Martin M Desrochers
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
In this paper, we have demonstrated a plasma activated low-temperature die-level oxide-oxide direct bonding with advanced wafer dicing technologies. This evaluation used blanket 300-mm silicon wafers. $1\ \mu\mathrm{m}$ Tetraethyl orthosilicate (TEOS
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dba5ed58982130cfce46c492c6fbd1c8
https://doi.org/10.1109/ectc32696.2021.00075
https://doi.org/10.1109/ectc32696.2021.00075