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Publikováno v:
IEEE Transactions on Advanced Packaging. 30:485-490
Wafer bumping, via fluxless solder reflow, can be performed using electron attachment (EA) with nonflammable mixtures of hydrogen (= 4 vol%) in nitrogen. The EA process facilitates dissociation of molecular hydrogen at ambient pressure and a temperat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f524296b582f6b66846eb8cae69c9e9e
https://doi.org/10.1109/tadvp.2007.901581
https://doi.org/10.1109/tadvp.2007.901581
