Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Chul-Oh Yoon"'
Autor:
Hyojung Bae, Chaewon Seong, Vishal Burungale, Myeongheon Seol, Chul Oh Yoon, Soon Hyung Kang, Wan-Gil Jung, Bong-Joong Kim, Jun-Seok Ha
Publikováno v:
ACS Omega, Vol 7, Iss 11, Pp 9422-9429 (2022)
Externí odkaz:
https://doaj.org/article/c8df11be398a49ceb0df95040c67c5ae
Publikováno v:
Journal of Sensor Science and Technology. 16:150-158
The IEEE 1451 publication are available, this standard defines interface between sensor and processor, and plug and play in processor is possible. Also, Intelligence of sensor was possible because sensor includes transducer electronic data sheet (TED
Publikováno v:
Talanta. 70:546-555
In this paper, we describe design of a simple taste analyzing system using sensory system based on a multi-array chemical sensor (MACS) and personal digital assistant (PDA) for visual and quantitative analysis of different tastes using pattern recogn
Publikováno v:
Journal of Korean Sensors Society. 13:446-453
A portable electronic tongue (E-Tongue) system using an array of ion-selective electrode (ISE) and personal digital assistants (PDA) for recognizing and analyzing food and drink have been designed. By the employment of PDA, the complex algorithm such
Autor:
Jun Ho Lee, Joungho Kim, Woonghwan Ryu, Seungyoung Ahn, Byung-Hun Kum, Chul-Oh Yoon, Junwoo Lee, Hyun Seok Choi, Jonghoon Kim
Publikováno v:
IEEE Transactions on Advanced Packaging. 26:90-98
The multiple line grid array (MLGA) interposer was recently introduced as a future high-density high-speed bonding method. In this paper, we introduce an electrical model and high-frequency characteristics of the MLGA interposer. The high-frequency e
Publikováno v:
Molecular Crystals and Liquid Crystals Science and Technology. Section A. Molecular Crystals and Liquid Crystals. 310:297-302
7Li solid-state nuclear magnetic resonance (NMR) is employed to investigate the mechanism of electrochemical lithium-intercalation in various carbon materials. Multiple resonance line shapes observ...
Publikováno v:
International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458).
The MLGA package has been newly introduced as a future high-density and high-speed package method, developed by Glotech Inc. The properties and electrical characteristics of the MLGA package have been studied previously (Seungyoung Ahn et al, 2000).
Autor:
Joungho Kim, Woonghwan Ryu, Youngsoo Kim, Chul-Oh Yoon, Seungyoung Ahn, Joon-Woo Lee, Jonghoon Kim
Publikováno v:
2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).
In this paper, we firstly introduce a new type of high-density package, called as Multiple Line Grid Array (MLGA) package. The MLGA package is developed as a strong candidate for next-generation, cost-effective, and high-density package manufactured