Zobrazeno 1 - 10
of 77
pro vyhledávání: '"Chukwudi, Okoro"'
Publikováno v:
IUCrJ, Vol 2, Iss 6, Pp 635-642 (2015)
Nondestructive measurements of the full elastic strain and stress tensors from individual dislocation cells distributed along the full extent of a 50 µm-long polycrystalline copper via in Si is reported. Determining all of the components of these te
Externí odkaz:
https://doaj.org/article/4d04d43b42144935a58692836743437b
Autor:
Sean Garner, Rajesh Vaddi, Mandakini Kanungo, Chukwudi Okoro, Daniel Levesque, Barry Paddock, Prantik Mazumder
Publikováno v:
SID Symposium Digest of Technical Papers. 53:218-220
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ff0b86d4081d88d15ef4fb6cbf22e411
https://doi.org/10.1002/sdtp.15457
https://doi.org/10.1002/sdtp.15457
Publikováno v:
IEEE Transactions on Device and Materials Reliability. 21:354-360
This work aims at understanding and eliminating thermo-mechanically induced circumferential cracks that form during cooling for a 400 °C annealed copper (Cu) through-glass via (TGV) with a mean outer diameter of $47.5~\mu \text{m}$ , made in Corning
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::86c5825d8b252834bf324ea2abbfc14a
https://doi.org/10.1109/tdmr.2021.3096931
https://doi.org/10.1109/tdmr.2021.3096931
Autor:
Justice Chukwudi Okoro
Publikováno v:
UJAH: Unizik Journal of Arts and Humanities. 22:240-277
This paper unfolds systematically organized requisite performance composition defined in words and with exemplary scores to buttress the texture. The communication principles of behaviour, protocols, skill and tools needed to achieve music disseminat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::743895910daf9383498110c4e73f6691
https://doi.org/10.4314/ujah.v22i1.10
https://doi.org/10.4314/ujah.v22i1.10
Publikováno v:
IEEE Transactions on Device and Materials Reliability. 21:129-136
In this work the influence of annealing dwell time and temperature, as well as post-annealing thermal processing treatment on copper (Cu) protrusion in Cu through-glass vias (TGVs) were studied. The Cu TGVs were made in Corning HPFS Fused Silica subs
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d6fe51b9de729efa89ea8feee3be2ce3
https://doi.org/10.1109/tdmr.2021.3059227
https://doi.org/10.1109/tdmr.2021.3059227
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1fef34d184f063772131ced252b3c405
https://doi.org/10.1109/ectc51906.2022.00194
https://doi.org/10.1109/ectc51906.2022.00194
Publikováno v:
Multidiscipline Modeling in Materials and Structures. 17:451-464
PurposeThis study aims to investigate the factors responsible for substrate cracking reliability problem in through-glass vias (TGVs), which are critical components for glass-based 2.5 D integration.Design/methodology/approachNumerical models were us
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b7356a590edf7af47ab3c4cc4ae09912
https://doi.org/10.1108/mmms-05-2020-0125
https://doi.org/10.1108/mmms-05-2020-0125
Publikováno v:
Microelectronics International. 37:181-188
PurposeGlass is a promising interposer substrate for 2.5 D integration; yet detailed analysis of the interfacial reliability of through-glass vias (TGVs) has been lacking. The purpose of this paper is to investigate the design and material factors re
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5254b9afded87f97b2037123a4884b2a
https://doi.org/10.1108/mi-04-2020-0020
https://doi.org/10.1108/mi-04-2020-0020
Publikováno v:
IEEE Transactions on Device and Materials Reliability. 20:199-203
In this study, the micro-compression of freestanding copper (Cu) through-glass vias (TGVs) is presented. An innovative approach was developed to obtain freestanding Cu TGVs where the Cu overburden was used as a bottom platen for the micro-compression
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::985501466215eafd97120a163e92073a
https://doi.org/10.1109/tdmr.2020.2973940
https://doi.org/10.1109/tdmr.2020.2973940
Autor:
Papa K. Amoah, Christopher E Sunday, Chukwudi Okoro, Jungjoon Ahn, Lin You, Dmitry Veksler, Joseph Kopanski, Yaw Obeng
Publikováno v:
ECS Meeting Abstracts. :859-859
In this talk, we present an overview of our current research focus in developing non-destructive metrology for monitoring reliability issues in 3D-integrated electronic systems. Working closely with the semiconductor industry, we have been looking at
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9551a0fca750d1052b0000a782b864f8
https://doi.org/10.1149/ma2022-0217859mtgabs
https://doi.org/10.1149/ma2022-0217859mtgabs