Zobrazeno 1 - 10
of 182
pro vyhledávání: '"Chuang, T.H"'
Publikováno v:
In Materials and Design August 2012 39:475-483
Ag-alloy bonding wire has excellent physical properties and is widely applied in microelectronics, but growing concerns about circuit failure induced by electromigration (EM) have raised doubts about this material. One point of frequent debate is the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______610::8f18288ad33fe12a84cc47adfc486044
https://publica.fraunhofer.de/handle/publica/435834
https://publica.fraunhofer.de/handle/publica/435834
Publikováno v:
In Materials and Design 2011 32(10):4720-4727
Publikováno v:
In Journal of Alloys and Compounds 2009 488(1):174-180
Publikováno v:
In Journal of Materials Processing Tech. 2008 202(1):22-26
Publikováno v:
In Experimental Thermal and Fluid Science 2008 32(4):927-938
Publikováno v:
In Scripta Materialia 2007 56(1):45-48
Publikováno v:
In Materials Characterization 2002 48(4):341-346
Publikováno v:
In Materials Characterization 2001 47(5):401-409
Publikováno v:
In Materials Characterization 1999 43(4):217-226