Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Chua Kok Keng"'
Publikováno v:
2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA).
Flip chip ball grid array (FCBGA) packages is becoming more attractive for automotive applications driven by the high performance requirement. Stacked vias are widely used in FCBGA substrate due to higher routing request. The reliability of stacked v
Publikováno v:
2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits.
As device geometries shrink and operating voltage and current levels keep reducing, conventional Passive Voltage Contrast techniques no longer proves to be effective for the current technology node. In this analysis, a combination of AFP pico-current
Publikováno v:
2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits.
Defect localization becomes ever more challenging for low leakage failures especially with the dies stacking. More fault localization tools and innovative analytical techniques and procedures will be required during failure analysis. In this case, a
Publikováno v:
International Symposium for Testing and Failure Analysis.
With the device geometries shrinking, defect isolation becomes more challenging with the reduction of operating voltage and current levels. In this failure analysis study, a combination of AFP current contrast imaging and nanoprobing at the contact l
Publikováno v:
Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
Defect isolation becomes ever more challenging with shrinking device geometries and reducing operating voltage and current levels. In this failure analysis, a combination of AFP current contrast imaging and nano-probing at the contact layer successfu
Publikováno v:
2004 IEEE International Conference on Semiconductor Electronics.
In this paper, a case study on the failure analysis and yield enhancement on poly grooves/divots in wafer fabrication was investigated and studied. Several failure analysis techniques and tools such as SEM, Auger electron spectroscopy (AES) and trans
Publikováno v:
Proceedings of the 20th IEEE International Symposium on the Physical & Failure Analysis of Integrated Circuits (IPFA); 2013, p284-288, 5p
Publikováno v:
2006 13th International Symposium on the Physical & Failure Analysis of Integrated Circuits; 2006, p217-221, 5p