Zobrazeno 1 - 3
of 3
pro vyhledávání: '"ChuMan Ho"'
Autor:
Yang Bin, Hua Xiangang, Guannan Yang, Chao Li, Chengqiang Cui, Lin Tingyu, ChuMan Ho, Yu Zhang
Publikováno v:
2020 21st International Conference on Electronic Packaging Technology (ICEPT).
With the advent of the information age, electronic packaging technology is developing in the direction of high power, high density, miniaturization, high reliability and green packaging. Because the third-generation semiconductor material has advanta
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f32e1bb324a82f54caf219be8ac7d515
https://doi.org/10.1109/icept50128.2020.9202915
https://doi.org/10.1109/icept50128.2020.9202915
Autor:
Lin Tingyu, Guannan Yang, Chao Li, ChuMan Ho, Zhou Zhangqiao, Chengqiang Cui, Yang Bin, Hua Xiangang, Yu Zhang
Publikováno v:
Web of Science
As one of the four key basic materials in the field of microelectronic packaging, Bonding wire is the internal lead to realize the electrical interconnection between chip and lead frame. Its quality directly determines the performance of microelectro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::aef6c513aa0d971af3f1194d1bb4d87a
https://doi.org/10.1109/icept50128.2020.9201943
https://doi.org/10.1109/icept50128.2020.9201943
Autor:
Li Chao, ChuMan Ho, Yang Bin, Guannan Yang, Zhou Zhangqiao, Hua Xiangang, Chengqiang Cui, Lin Tingyu, Yu Zhang
Publikováno v:
2020 21st International Conference on Electronic Packaging Technology (ICEPT).
With excellent conductivity, ductility, reflectivity and low-cost advantages, silver bonding wire is a more competitive material which can replace the gold wire. It is widely used in display LED and storage fields. However, the key to the application
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e4888f8b9b3b72cec4e47257d16fa306
https://doi.org/10.1109/icept50128.2020.9202913
https://doi.org/10.1109/icept50128.2020.9202913