Zobrazeno 1 - 10
of 24
pro vyhledávání: '"Chu Yee Khor"'
Autor:
Suhaib Ibrahim Alma'asfa, Feras Younes Fraige, Mohd Sharizal Abdul Aziz, Chu Yee Khor, Laila A Al-Khatib
Publikováno v:
International Journal of Renewable Energy Development, Vol 13, Iss 4, Pp 608-617 (2024)
The global energy demand is rising, driven by population growth, economic development, and industrialization. Shifting towards renewable energy, like solar energy, is gaining momentum worldwide because of ecological concerns and resource depletion. T
Externí odkaz:
https://doaj.org/article/7f70a967a9514223a551dc1c33c94f6a
Publikováno v:
Journal of Manufacturing and Materials Processing, Vol 8, Iss 2, p 62 (2024)
This study addresses the effects of densification at varied pelletization temperatures on the novel Malaysian Khaya senegalensis wood-derived pellets biomass fuel characteristics. The lack of comprehensive understanding regarding the biomass fuel cha
Externí odkaz:
https://doaj.org/article/0429feea4e904da38491acfc66d07a87
Publikováno v:
Metals, Vol 13, Iss 3, p 619 (2023)
Magnesium alloys have broad applications, including medical implants and the aerospace sector owing to their great density and high strength-to-weight ratio. Dry cutting is a frequent technique for machining this material. However, it always leads to
Externí odkaz:
https://doaj.org/article/5f6b2396b0ad4e1a938f1b079f97c68b
Autor:
Chu Yee Khor
Publikováno v:
Maejo International Journal of Science and Technology, Vol 6, Iss 02, Pp 159-185 (2012)
This paper presents the modelling and analysis of the encapsulation processfor three-dimensional (3D) stacking-chip package with through-silicon via (TSV)integration. The fluid-structure interaction of the 3D stacking-chip package encapsulationwas mo
Externí odkaz:
https://doaj.org/article/c7c4568ae007437a85f0ca5a3558195a
Publikováno v:
CMES-Computer Modeling in Engineering & Sciences; 2024, Vol. 140 Issue 1, p109-137, 29p
Autor:
Mark Selvan, Mohd Sharizal Abdul Aziz, Kok Hwa Yu, M. S. Nurulakmal, H. P. Ong, Chu Yee Khor, Wan Rahiman
Publikováno v:
Numerical Heat Transfer, Part A: Applications. :1-20
Publikováno v:
The International Journal of Advanced Manufacturing Technology. 121:4325-4353
Autor:
Mohd Yusuf Tura Ali, Chu Yee Khor, Azwan Iskandar Azmi, Mohd Zulklifly Abdullah, Zambri Samsudin, Idris Mansor, Muhammad Irsyad Suhaimi, Muhammad Syahir Mahyuddin, Lai Ming Lim
Publikováno v:
ASEAN Engineering Journal. 12:205-210
Recent developments in the electronics industry have introduced a multi-stack ball grid array (BGA) to meet the growing consumer demand for both high-performance and smaller-sized chip packages. This study focused on the preliminary study of the Pack
Autor:
Jing Rou Lee, Mohd Sharizal Abdul Aziz, Mohd Arif Anuar Mohd Salleh, Chu Yee Khor, Mohammad Hafifi Hafiz Ishak
Publikováno v:
The Minerals, Metals & Materials Series ISBN: 9783031225239
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::23716c5d1dd3bea402a454019854a485
https://doi.org/10.1007/978-3-031-22524-6_84
https://doi.org/10.1007/978-3-031-22524-6_84
Autor:
Mark Selvan, Mohd Sharizal Abdul Aziz, Mohd Arif Anuar Mohd Salleh, Nurulakmal Mohd Sharif, Chu Yee Khor, Heng Pin Ong, Mohd Remy Rozaini Mohd Arif Zainol, Petrica Vizureanu, Diana-Petronela Burduhos-Nergis, Andrei Victor Sandu
Publikováno v:
Coatings; Volume 13; Issue 1; Pages: 12
This paper studies the fin thickness variation effect on a bus duct conductor’s thermal performance and the nanocomposite coating method selection for the bus duct conductor’s heat sink. ANSYS FLUENT was used to create a numerical model resemblin