Zobrazeno 1 - 10
of 31
pro vyhledávání: '"Chu OH"'
Real-time Monitoring of Photosynthesis and Transpiration of a Fully-grown Tomato Plant in Greenhouse
Autor:
Yuri Isoyama, Kota Shimomoto, Kotaro Takayama, Hiroshige Nishina, Shin-Chu Oh, Noriko Takahashi, Inaba Kazue
Publikováno v:
Environment Control in Biology. 58:65-70
Publikováno v:
IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 17:496-506
3-D stacking and integration can provide system advantages. This paper explores application drivers and computer-aided design (CAD) for 3-D integrated circuits (ICs). Interconnect-rich applications especially benefit, sometimes up to the equivalent o
Autor:
Paul D. Franzon, Eun Chu Oh
Publikováno v:
3DIC
In our previous work, 3D TCAMs were designed and evaluated with different 3D partitioning schemes showing that a 40% reduction in matchline interconnect capacitance, 21% power reduction, and 25% reduction in precharge time is achieved in TCAM memory
Autor:
Seungwon Baek, Myoung Chu Oh, Beverly Karplus Hartline, Renee K. Horton, Catherine M. Kaicher
Publikováno v:
AIP Conference Proceedings.
The tribimaximal form of the neutrino mixing matrix can be naturally obtained with A_4 flavor symmetry. We consider triplet Higgs model with A_4 symmetry to generate the neutrino masses. With neutrino oscillation data we show that the mass matrix can
Autor:
Myoung Chu Oh, Seungwon Baek
We consider triplet Higgs model with $A_4$ symmetry to generate the neutrino mass matrix. The tribimaximal form of the neutrino mixing matrix can be naturally obtained. Imposing the neutrino oscillation data, we show that 1) both normal and inverted
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::80c978a6be29e69eda2f17154932be2c
http://arxiv.org/abs/0812.2704
http://arxiv.org/abs/0812.2704
Autor:
Ben Shani, Steve Lipa, Tad Doxsee, Paul D. Franzon, W. Rhett Davis, Michael B. Steer, Stephen Berkeley, Sonali Luniya, Thor Thorolfsson, Kurt Obermiller, Samson Melamed, Eun Chu Oh
Publikováno v:
DAC
High density through silicon vias (TSV) can be used to build 3DICs that enable unique applications in computing, signal processing and memory intensive systems. This paper presents several case studies that are uniquely enhanced through 3D implementa
Autor:
Eun Chu Oh, Paul D. Franzon
Publikováno v:
CICC
Three dimensional (3D) ternary content addressable memory (TCAM) has been designed in a 0.18 mum fully depleted silicon on insulator (FD SOI) 3D IC process. This paper demonstrates that a 3D TCAM with three tiers can achieve 40% matchline capacitance
Autor:
Paul D. Franzon, Eun Chu Oh
Publikováno v:
SPIE Proceedings.
Ternary Content Addressable Memory (TCAM) has been an emerging technology for fast packet forwarding, commonly used in longest prefix match routing. Large table size requirements and wider lookup table data widths have led to higher capacity TCAM des
Autor:
Eun Chu Oh, Franzon, P.D.
Publikováno v:
2009 IEEE International Conference on 3D System Integration; 2009, p1-5, 5p
Autor:
Franzon, Paul D., Davis, W. Rhett, Steer, Michael B., Lipa, Steve, Eun Chu Oh, Thorolfsson, Thor, Melamed, Samson, Luniya, Sonali, Doxsee, Tad, Berkeley, Stephen, Shani, Ben, Obermiller, Kurt
Publikováno v:
DAC: Annual ACM/IEEE Design Automation Conference; 2008, p668-673, 6p, 1 Color Photograph, 4 Diagrams, 6 Charts, 5 Graphs