Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Chrystelle Lagahe"'
Autor:
Richard Fontaniere, Arnaud Castex, Marcel Broekaart, Chrystelle Lagahe-Blanchard, Karine Landry
Publikováno v:
ECS Transactions. 50:371-377
Significant distortion can originate during the bonding process, resulting in overlay issues for final backside illumination image sensor wafer processing, impacting final wafer yield and device reliability. This paper presents a distortion free bond
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::fb70e991b643759347a56907134b453c
https://doi.org/10.1149/05007.0371ecst
https://doi.org/10.1149/05007.0371ecst
Autor:
Chrystelle Lagahe, Arnaud Castex, Richard Fontaniere, Stephane Thieffry, Karine Landry, Marcel Broekaart
Publikováno v:
ECS Transactions. 35:145-151
This paper presents a new wafer bonding process used for back side illuminated (BSI) image sensors manufacturing, with high bonding energy of 2 J/m2, without peripheral edge bonding voids that occur with the standard process.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7ae987dd7e803e57eb38a5af633c86e7
https://doi.org/10.1149/1.3568856
https://doi.org/10.1149/1.3568856
Publikováno v:
ECS Transactions. 3:79-90
Direct wafer bonding is a generic technology enabling the fabrication of innovative structures. Adequate surface treatments allow bonding of virgin as well as partially or fully processed wafers, leading to new Anti-sticking BSOI, Patterned BSOI and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6f979163e649545fd252e7d6baa325ae
https://doi.org/10.1149/1.2357057
https://doi.org/10.1149/1.2357057
Publikováno v:
ICICDT
The wafer stacking technology for 3D integration requires high quality bonding interfaces with uniform bonding films. Two wafer level stacking technologies - Smart Stacking™ and Smart Cut™ - are developed to address the manufacturing challenges f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::07e41618fd21b8ab64a42a6c8b40786b
https://doi.org/10.1109/icicdt.2013.6563343
https://doi.org/10.1109/icicdt.2013.6563343
Autor:
Christian Seassal, Chrystelle Lagahe-Blanchard, Xavier Letartre, G. Hollinger, Joost Brouckaert, Roel Baets, D. Van Thourhout, Gunther Roelkens, J-M. Fedeli, A. Kazmierczak, Philippe Regreny, L. Di Cioccio, P. Rojo Romeo, J. Van Campenhout
Publikováno v:
MATERIALS TODAY
Photonic integrated circuits offer the potential of realizing low-cost, compact optical functions. Silicon-on-insulator (SOI) is a promising material platform for this photonic integration, as one can rely on the massive electronics processing infras
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::35011d742b451e4b9c42397c3ed771ef
https://hdl.handle.net/1854/LU-389064
https://hdl.handle.net/1854/LU-389064
Autor:
Arnaud Castex, Marcel Broekaart, Stephane Thieffry, Karine Landry, Richard Fontanière, Chrystelle Lagahe
Publikováno v:
ECS Meeting Abstracts. :1157-1157
not Available.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1ddfcc3239a41e25b9ca6c6936a6448f
https://doi.org/10.1149/ma2011-01/16/1157
https://doi.org/10.1149/ma2011-01/16/1157
Publikováno v:
ECS Meeting Abstracts. :1355-1355
not Available.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c34afded131bae06fd6f58a08652cb67
https://doi.org/10.1149/ma2006-02/30/1355
https://doi.org/10.1149/ma2006-02/30/1355
Publikováno v:
Journal of Applied Physics. 99:103509
The effect of hydrogen implantation in silicon single crystals is studied using high-resolution x-ray scattering. Large strains normal to the sample surface are evidenced after implantation. A simple and direct procedure to extract the strain profile
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2e8d66a94b6a82cc6f2c657d8c090388
https://doi.org/10.1063/1.2198928
https://doi.org/10.1063/1.2198928
Publikováno v:
ECS Meeting Abstracts. :482-482
not Available.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b22e0e6c6a7103fb40bfece085565d90
https://doi.org/10.1149/ma2005-01/11/482
https://doi.org/10.1149/ma2005-01/11/482
Autor:
Lea di Cioccio, Beatrice Biasse, Marek Kostrzewa, Marc Zussy, Jerome Dechamp, Barbara Charlet, Maud Vinet, Jean Marc Fedeli, Thierry Poiroux, Nelly Kernevez, Philippe Regreny, Chrystelle Lagahe-Blanchard, Bernard Aspar
Publikováno v:
ECS Meeting Abstracts. :518-518
not Available.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4c9e925e0a779bb6b04f62f8b9a4b08a
https://doi.org/10.1149/ma2005-01/11/518
https://doi.org/10.1149/ma2005-01/11/518