Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Christy S. Tyberg"'
Publikováno v:
ITC
Multilayer (3D) integrated circuit technology (3D chip technology) provides an attractive alternative to conventional circuit scaling methods, which rely solely on continued shrinking of device dimension. Chip stacking, through the use of through sil
Autor:
Richard Langlois, Christy S. Tyberg, Ray Robertazzi, Pascale Gagnon, Katsuyuki Sakuma, Christian Bergeron, Michael Scheurmann, Stephane Barbeau, Steve Whitehead, Matthew Wordeman
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
3D multi-layer chip stacking is a significant assembly challenge with dependencies on die size and thickness, interconnect pitch, bump diameter, number of dies involved, and die warpage. The assembly processes used to overcome the technical difficult
Autor:
Christian Bergeron, Michael R. Scheuermann, R. P. Robertazzi, M. Wordeman, S. Tian, Christy S. Tyberg, Joel Abraham Silberman, H. Jacobson, Phillip J. Restle
Publikováno v:
3DIC
3D chip stacking technology has the potential to enable increased system performance through integration of heterogeneous system components, such as accelerators and high density memory, as well as through increased area for tightly integrated proces
Autor:
Koushik Ramachandran, Robert J. Gauthier, Thuy Tran-Quinn, You Li, Christy S. Tyberg, Matthew Angyal, Joel Abraham Silberman, Ephrem G. Gebreselasie, Katsuyuki Sakuma, Souvick Mitra
Publikováno v:
Scopus-Elsevier
A Design of Experiments (DOEs) matrix was created to evaluate probability of fails during a complex 3D integration process as a function of ESD protection level. A detailed set of pass/fail criteria based on circuit performance was established. Based
Publikováno v:
IRPS
Addressable transistor arrays (∼20,000 devices) provide an attractive test vehicle to study TSV/FET proximity effects in a statistically meaningful way. FET/TSV proximity effect studies have been performed at the 45 nm node using a dense addressabl
Publikováno v:
Polymer Bulletin. 48:167-172
The structure and properties of Hydrido Organo Siloxane Polymer (HOSP) as a function of cure conditions have been analyzed. Fourier transform infrared spectroscopy, dielectric constant, and mechanical properties all indicated a dependence on the bake
Autor:
Katsuyuki Sakuma, Qianwen Chen, R. P. Robertazzi, John U. Knickerbocker, Christy S. Tyberg, Michael A. Gaynes, Michael R. Scheuermann, Paul S. Andry, Jae-Woong Nah, Joana Maria, Cornelia K. Tsang, Bing Dang
Publikováno v:
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
Autor:
Rai Moriya, B Bert Koopmans, Stuart S. P. Parkin, Luc Thomas, Masamitsu Hayashi, Bastiaan Bergman, Eric A. Joseph, John Hummel, Christy S. Tyberg, Mary-Beth Rothwell, Yu Lu, William J. Gallagher
Publikováno v:
Applied Physics Letters, 95(26):262503, 262503-1/3. American Institute of Physics
We describe a technique for generating local magnetic fields at megahertz rates along magnetic nanowires. Local and global magnetic fields are generated from buried copper fine-pitch wires fabricated on 200 mm silicon wafers using standard complement