Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Christopher S. Litteken"'
Autor:
Michael E. Mills, Andrew V. Kearney, Carol Mohler, Christopher S. Litteken, Reinhold H. Dauskardt
Publikováno v:
Acta Materialia. 56:5946-5953
Poly(arylene) ether (PAE) polymer films containing controlled nanometer-sized pores are shown to exhibit increasing fracture resistance with porosity. Such surprising behavior is in stark contrast to widely reported behavior for the fracture toughnes
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c99344ae45792827b5e324f748d451eb
https://doi.org/10.1016/j.actamat.2008.08.009
https://doi.org/10.1016/j.actamat.2008.08.009
Publikováno v:
Acta Materialia. 53:1955-1961
Residual stress in ductile thin films is shown to significantly affect the extent of film plasticity and interfacial fracture energy during debonding in thin-film structures. Specifically, the interfacial fracture resistance of a TaN/SiO2 interface i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2b3d8af459ced5b5eaa64fce21c4eca7
https://doi.org/10.1016/j.actamat.2005.01.005
https://doi.org/10.1016/j.actamat.2005.01.005
Publikováno v:
Acta Materialia. 53:609-616
Adhesion of Pt films to Si substrates with a native SiO2 oxide has been investigated using telephone cord induced delamination as well as the four-point bending method. Telephone cord delamination was induced by sputtering a thick compressively stres
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::af5ecf73ba5e4b469fa88310ce7a29f0
https://doi.org/10.1016/j.actamat.2004.10.014
https://doi.org/10.1016/j.actamat.2004.10.014
Publikováno v:
International Journal of Fracture. :475-485
The adhesion of interfaces in thin-film structures containing ductile polymer blanket films and patterned lines is reported. The intent of the study was to demonstrate that both the film thickness and the aspect ratio of patterned lines have a signif
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::226b092558b9ec05c8e54b5b390ff02a
https://doi.org/10.1023/a:1024940132299
https://doi.org/10.1023/a:1024940132299
Publikováno v:
Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005..
The four-point bend method has become an established metrology for quantitatively examining interfacial fracture energies of thin film multi-layers. However, despite the widespread use of the technique, relatively little is known about how four-point
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8fcc985d0fe6200feded7a6e5c17935d
https://doi.org/10.1109/iitc.2005.1499917
https://doi.org/10.1109/iitc.2005.1499917
Autor:
Reinhold H. Dauskardt, T. Scherban, B. Sun, G. Xu, Christopher S. Litteken, David H. Gracias, Jihperng Leu
Publikováno v:
Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695).
The interfacial adhesion of lithographically patterned thin film structures has been measured. Fracture mechanics techniques, modified for thin-film geometries, were employed to quantify the interfacial adhesion of patterned arrays containing low-k a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0d52bb3066d48b70df91e4e99fe6ff89
https://doi.org/10.1109/iitc.2003.1219744
https://doi.org/10.1109/iitc.2003.1219744