Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Christopher R. Wargo"'
Publikováno v:
ECS Transactions. 41:27-32
This paper focuses on the challenges and new developments in chemical mechanical planarization (CMP) pad conditioner technology for the next-generation applications, with a special emphasis on the comparative performance characterization of pad condi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3d7658af371d99fee2121641e775c9af
https://doi.org/10.1149/1.3699375
https://doi.org/10.1149/1.3699375
Autor:
Rakesh K. Singh, M. Vinogradov, V. Khosla, David Stockbower, N. V. Gitis, Christopher R. Wargo
Publikováno v:
STLE/ASME 2008 International Joint Tribology Conference.
CMP process yield depends on effectiveness of a post-CMP cleaning, which should reduce roughness of the polished wafer and leave it defect-free, consistently removing particles, organic residues, and ionic contamination. This paper presents an overvi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::52b8998162d1e91b7fb7e61e6c456969
https://doi.org/10.1115/ijtc2008-71017
https://doi.org/10.1115/ijtc2008-71017
Publikováno v:
BusinessWest. 7/29/2013, Vol. 30 Issue 6, p58-64. 7p.