Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Christopher R. Carr"'
Autor:
Takuya Kuroda, HyoungKook Kim, Hsin-Hui Huang, Shannon Dunn, Jasper P. Munson, Russell A. Black, Victor A. Perez, Christopher R. Carr, Preston A. Crupe
Publikováno v:
SPIE Proceedings.
The Global 450mm Consortium (G450C), which is located at the SUNY Poly campus in Albany, NY was created to develop and evaluate a manufacturing tool set for 450mm wafers. The Lithography cell at G450C consists of a Nikon NSR-S650D 193nm immersion sca
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e36e369c36ed04dc19500a2d35f02266
https://doi.org/10.1117/12.2257633
https://doi.org/10.1117/12.2257633
Autor:
Christopher R. Carr, Victor A. Perez, Takuya Kuroda, HyoungKook Kim, Russell A. Black, Hsin-Hui Huang, Shannon Dunn, Preston A. Crupe, Jasper P. Munson
Publikováno v:
SPIE Proceedings.
The Global 450mm Consortium (G450C) has completed its 5th year of developing and evaluating manufacturing 450mm tool sets. This paper focuses on how the lithography cell resolution performance has progressed from tool acceptance to current day. Initi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f334514fd682c83fa4631b840bfa417b
https://doi.org/10.1117/12.2257642
https://doi.org/10.1117/12.2257642
Autor:
Katherine Sieg, Christopher R. Carr, Karsten Schaefer, M. F. Chen, Christopher L. Borst, David Skilbred, Jong-heun Lim, Kosta Culafi, Milo Tallon, Norman Fish, Frank Robertson, Chulgi Song, John Hagwood, Anne-Sophie Larrea, Angelo Alaestante, Mark Kelling, ChungJu Yang, Denis Sullivan, WenLi Collision, Nithin Yathapu, Hsi-Wen Liu, Yii-Cheng Lin, Cheng-Chung Chien, Erin Fria, Regina Swaine, Gerard Stapf, Dan Franca, BumKi Moon, K. K. W. Lee, Bruce Gall, Jamie Prudhomme, Yu-Lieh Fu, Alexander Bialy, Stock Chang, Shannon Dunn, Michael Bryant, Lin Pinyen, Huey-Ming Wang, Joe Maniscalco, Richard Conti, Rand Cottle, Barry Wang, Steven Smith, Sun-OO Kim
Publikováno v:
2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC).
At 450mm wafer area, the first Cu BEOL module process was demonstrated with a single damascene structure using low-k ILD, TiN metal hard mask and guided 20nm half-pitched lamella BCP DSA patterning. It showed the potential opportunities, technical fe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::16f5a6641fe5a8a4871bd779ed63e8be
https://doi.org/10.1109/iitc-amc.2016.7507638
https://doi.org/10.1109/iitc-amc.2016.7507638
Publikováno v:
2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
The semiconductor industry finds itself at a crossroad with the question of how to continue to drive Moore's law. The industry is exploring many avenues to drive transistor scaling as well as reduction in cost for the future nodes. Some of the popula
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::794083c853842f3c5ab8f2f6649c1929
https://doi.org/10.1109/asmc.2016.7491082
https://doi.org/10.1109/asmc.2016.7491082
Publikováno v:
mSphere, Vol 4, Iss 3 (2019)
ABSTRACT Neuropilin-1 (Nrp1) plays important roles in axonal guidance in neurons and in the growth of new blood vessels. There is also a growing appreciation for roles played by neuropilin-1 in the immune response. This molecule is important for the
Externí odkaz:
https://doaj.org/article/6bd1a1c403354de7b08547598013d67a