Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Christopher M. Duron"'
Publikováno v:
AIAA Propulsion and Energy 2019 Forum.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c5e69e76732db42c09fc799dfc3dcb3c
https://doi.org/10.2514/6.2019-3806
https://doi.org/10.2514/6.2019-3806
Autor:
Jacob R. Morris, Allan E. David, William R. Ashurst, Sushil H. Bhavnani, Andrew C. Bates, Christopher M. Duron, Jie Zhong
Publikováno v:
Volume 1: Boilers and Heat Recovery Steam Generator; Combustion Turbines; Energy Water Sustainability; Fuels, Combustion and Material Handling; Heat Exchangers, Condensers, Cooling Systems, and Balance-of-Plant.
The condenser performance benefits afforded by dropwise condensation have long been unattainable in steam cycle power plant condensers due to the unavailability of durable and long lasting wetting inhibiting surface treatments. However, recent work i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::1b6340bcffe8c37098356a35ee2faf79
https://doi.org/10.1115/power-icope2017-3080
https://doi.org/10.1115/power-icope2017-3080
Publikováno v:
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
As phase change, specifically boiling becomes an ever more popular and advanced mechanism for cooling electronics, efforts must be made to find methods of increasing the thermal performance of condensers.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cfd2ffcf539ccb9a2304f88ddaf148a1
https://doi.org/10.1109/itherm.2016.7517625
https://doi.org/10.1109/itherm.2016.7517625
Autor:
Roy W. Knight, Christopher M. Duron, Sushil H. Bhavnani, Aravind Sridhar, Sarah Styslinger, R. Wayne Johnson, Daniel K. Harris
Publikováno v:
Volume 2: Heat Transfer Enhancement for Practical Applications; Fire and Combustion; Multi-Phase Systems; Heat Transfer in Electronic Equipment; Low Temperature Heat Transfer; Computational Heat Transfer.
An alternative to air-cooling of high performance computing equipment is presented. Heat removal via pool boiling in FC-72 was tested. Tests were conducted on a multichip module using 1.8 cm × 1.8 cm test die with multiple thermal test cells with te
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::03a484bb4a75eeb3f480561dd23d02d2
https://doi.org/10.1115/ht2012-58433
https://doi.org/10.1115/ht2012-58433