Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Christopher L. Tessler"'
Autor:
Benjamin V. Fasano, Richard F. Indyk, Brittany Hedrick, Franklin M. Baez, Jorge Lubguban, Michael S. Cranmer, Shidong Li, Luc Guerin, Sarah H. Knickerbocker, David J. Lewison, Marc Phaneuf Luc Ouellet, Ian D. Melville, Koushik Ramachandran, Charles L. Arvin, Maryse Cournoyer, Daniel Berger, Christopher L. Tessler, John J. Garant, Matthew Angyal, Jean Audet, Vijay Sukumaran, Subramanian S. Iyer
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
The processes key to enabling 3D manufacturing, namely, bond, backgrind, and through silicon via (TSV) reveal, are extended for 300 mm glass substrates to fabricate a heterogeneous, multi-die, 2.5D glass interposer. Based on an existing silicon inter
Autor:
David Danovitch, G. P. Brouillete, M. R. Turgeon, Valerie Oberson, Peter A. Gruber, Jean-Luc Landreville, D. T. Naugle, Luc Belanger, Da-Yuan Shih, Christopher L. Tessler
Publikováno v:
IBM Journal of Research and Development. 49:621-639
As the demand for flip-chip interconnects mounts across an increasingly large spectrum of products and technologies, several wafer-bumping proeesses have been developed to produce the small solder features required for this interconnect technology. T
Publikováno v:
Microelectronic Engineering. 20:3-14
A high-power excimer laser projection ablation tool and process in a manufacturing line is described. The light source is a 150 W XeCl (308 nm) gas laser. The projection ablation unit is very similar to that of a photo expose tool and comparisons wil
Publikováno v:
SPIE Proceedings.
This paper is a description of the ablation of polyimide with an excimer laser ablation tool in a manufacturing line. The light source is a 150 watt, XeCl (308 nm) gas laser. Two methods of ablating via patterns with the laser tool (full-chip and sca
Conference
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Conference
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