Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Christopher K. White"'
Autor:
Barry K. Gilbert, Chad M. Smutzer, Clifton R. Haider, Jordan R. Keuseman, Christopher K. White
Publikováno v:
2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4cbda441340bddd422f341e82eefa2f7
https://doi.org/10.1109/epeps51341.2021.9609134
https://doi.org/10.1109/epeps51341.2021.9609134
Autor:
Jordan R. Keuseman, Clifton R. Haider, Barry K. Gilbert, Tim Daun-Lindberg, Christopher K. White
Publikováno v:
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI).
Voltage regulator impedance characterization is a straightforward concept but the challenges in making high-fidelity measurements are numerous as the impedance becomes progressively smaller. This paper evaluates techniques used for low impedance buck
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::74b8ce9c48af4f1b3f58a72abab53913
https://doi.org/10.1109/emcsi38923.2020.9191556
https://doi.org/10.1109/emcsi38923.2020.9191556
Autor:
Barry K. Gilbert, Chad M. Smutzer, Christopher K. White, Clifton R. Haider, Michael J. Degerstrom
Publikováno v:
2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI).
A unique transmission line model for use in high-speed signal simulation was developed. This model, which we term as a “foundational” model, is specified by user-supplied electrical performance parameters, as opposed to the traditional use of phy
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::40cdfe072d5642d53de60382d5a3764f
https://doi.org/10.1109/isemc.2019.8825252
https://doi.org/10.1109/isemc.2019.8825252
Publikováno v:
2019 IEEE 23rd Workshop on Signal and Power Integrity (SPI).
Passive power delivery design has often been an afterthought in printed circuit board (PCB) and package design processes. Signal performance is frequently prioritized using the most optimal resources available to the design engineers. Based upon rece
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::efb04ba8ad2e9baa6181441c99f4f974
https://doi.org/10.1109/sapiw.2019.8781657
https://doi.org/10.1109/sapiw.2019.8781657
Publikováno v:
2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
Conductor surface roughness loss models typically use two physical parameters to vary losses. A similar model was developed that required a single parameter so that the model could alternatively be defined to have a specific loss attributed to surfac
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dd15d2489088d20eeaf1597ccb16a805
https://doi.org/10.1109/epeps.2018.8534270
https://doi.org/10.1109/epeps.2018.8534270
Autor:
W. Mao, Y. Gao, J. Winebrenner, R. L. Hartnl, N. Alkhdour, Y-M. Wong, E. Kleinfeld, Christopher K. White, U. Koren, Karim Tatah, Andy J. Becker
Publikováno v:
2006 European Conference on Optical Communications.
This paper reports the performance of the first un-cooled 80 Gigabit per second transceiver designed to provide very high speed optical interconnection for super-computers. Error free transmission is reported for 190 hours through 1km.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0204d2ea7afc1b707332ce8160c5a8bc
https://doi.org/10.1109/ecoc.2006.4801405
https://doi.org/10.1109/ecoc.2006.4801405