Zobrazeno 1 - 10
of 20
pro vyhledávání: '"Christopher D. New"'
Publikováno v:
IEEE Open Journal of Power Electronics, Vol 5, Pp 1182-1196 (2024)
Current conducted emissions standards provide considerable flexibility in the handling of interface converters, which are of increasing importance for the design and implementation of microgrids. Of particular interest herein is the approach selected
Externí odkaz:
https://doaj.org/article/f646afa465db41f6a7308f67469935c2
Publikováno v:
IEEE Open Journal of Power Electronics, Vol 3, Pp 731-740 (2022)
Electromagnetic interference (EMI) compliance is a requirement for most electronic systems and devices, including power electronics. The emergence of power electronic systems designed with wide band-gap (WBG) semiconductors poses new challenges for c
Externí odkaz:
https://doaj.org/article/3c482e6ed15b449eaa45cdacac168424
Autor:
Blake W. Nelson, Andrew N. Lemmon, Sergio J. Jimenez, H. Alan Mantooth, Brian T. DeBoi, Christopher D. New, Md Maksudul Hossain
Publikováno v:
IEEE Open Journal of Power Electronics, Vol 2, Pp 106-123 (2021)
Transient simulation of complex converter topologies is a challenging problem, especially in detailed analysis tools like SPICE. Transistor models presented for SPICE are often evaluated by accuracy, with less consideration for the computational cost
Externí odkaz:
https://doaj.org/article/0bdd76da4bdb4d0fbb338998f7086ab5
Autor:
Blake W. Nelson, Andrew N. Lemmon, Brian T. DeBoi, Md Maksudul Hossain, H. Alan Mantooth, Christopher D. New, Jared C. Helton
Publikováno v:
IEEE Open Journal of Power Electronics, Vol 1, Pp 499-512 (2020)
Transient simulation of complex converter topologies is a challenging problem, especially in detailed analysis tools like SPICE. Much of the recent literature on SPICE transistor modeling ignores the requirements of application designers and instead
Externí odkaz:
https://doaj.org/article/2ac63d65e626426c965920f659654420
Publikováno v:
2023 IEEE Applied Power Electronics Conference and Exposition (APEC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4db547413ba5077dfed1c1d85b1a5e73
https://doi.org/10.1109/apec43580.2023.10131165
https://doi.org/10.1109/apec43580.2023.10131165
Publikováno v:
IEEE Transactions on Power Electronics. 35:13400-13408
The accelerating commercialization of wide bandgap technology has led to increased demand for accurate characterization of parasitic impedances within packaging structures such as multichip power modules. However, the accuracy of known methods is not
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::53a4aec060e3abe7660aeb9cce997a6b
https://doi.org/10.1109/tpel.2020.2992332
https://doi.org/10.1109/tpel.2020.2992332
Publikováno v:
IEEE Transactions on Power Electronics. 35:8034-8049
Modern power converters designed with wide band-gap (WBG) semiconductors are known to generate substantial conducted electromagnetic interference (EMI) as a side effect of high-edge-rate and high-frequency switching. This article provides a consolida
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::19b389e3d31d250e63f92613f43c7160
https://doi.org/10.1109/tpel.2019.2963883
https://doi.org/10.1109/tpel.2019.2963883
Publikováno v:
IEEE Transactions on Power Electronics. 35:4678-4688
The fast edge rates achievable by wide-bandgap semiconductors can produce significant common-mode (CM) leakage currents through the baseplates of encompassing power modules, which are known to produce elevated electromagnetic signatures for power ele
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::84a8d59e9d4f38ac4c88566fea02e6b9
https://doi.org/10.1109/tpel.2019.2944410
https://doi.org/10.1109/tpel.2019.2944410
Autor:
Christopher D. New, Andrew N. Lemmon, H. Alan Mantooth, Maksudul Hossain, Blake W. Nelson, Brian T. DeBoi, Sergio Jimenez
Publikováno v:
IEEE Open Journal of Power Electronics, Vol 1, Pp 499-512 (2020)
Transient simulation of complex converter topologies is a challenging problem, especially in detailed analysis tools like SPICE. Transistor models presented for SPICE are often evaluated by accuracy, with less consideration for the computational cost
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::1e143f43a6a146f7e9866b625499a16d
https://ieeexplore.ieee.org/document/9250456/
https://ieeexplore.ieee.org/document/9250456/
Publikováno v:
2022 IEEE Applied Power Electronics Conference and Exposition (APEC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::11d395f24f545e6f227cc4429bb86a3c
https://doi.org/10.1109/apec43599.2022.9773588
https://doi.org/10.1109/apec43599.2022.9773588