Zobrazeno 1 - 10
of 38
pro vyhledávání: '"Christopher D. Meyer"'
Publikováno v:
IEEE Transactions on Electron Devices. 62:2270-2277
High-quality inductors are difficult to realize in stretchable electronics, since the thick parallel traces needed to minimize resistance also result in a highly rigid structure. Adding periodic waves or kinks to the traces of an inductor coil has be
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::19b41d46f520b3ca042b1f6019f41d5d
https://doi.org/10.1109/ted.2015.2431221
https://doi.org/10.1109/ted.2015.2431221
Autor:
Iain Kierzewski, Sarah S. Bedair, Nathan Lazarus, Brendan Hanrahan, Lauren Boteler, Christopher D. Meyer
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 5:895-901
This paper introduces a heterogeneous die integration process using electroplated copper to mount a bare die into a silicon handling wafer while simultaneously forming vertical, through-wafer vias. Deep reactive-ion etching is used to form openings i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e86f223781a2d2f5b8903f30a832c89d
https://doi.org/10.1109/tcpmt.2015.2444814
https://doi.org/10.1109/tcpmt.2015.2444814
Publikováno v:
RSC Advances. 5:78695-78700
Electrical traces made using liquid metal can survive strains of tens or hundreds of percent without damage. Liquid metal is promising for creating the thick cross sections and low resistance necessary for power devices, while maintaining high stretc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5d9694200b0c8ca9af003f674b907d13
https://doi.org/10.1039/c5ra17479a
https://doi.org/10.1039/c5ra17479a
Publikováno v:
IEEE Transactions on Power Electronics. 29:6052-6063
This paper presents a multilayer wiring board that integrates a copper air-core microinductor to enable a highly compact, chip-scale power converter module. The wiring board is wafer-level fabricated with three 30-μm-thick electroplated copper layer
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3b1db5031e40958a04e5fce50f88a59d
https://doi.org/10.1109/tpel.2013.2296507
https://doi.org/10.1109/tpel.2013.2296507
Publikováno v:
IEEE Transactions on Magnetics. 50:1-8
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::57c6e801e525c6cf788937cba151a04a
https://doi.org/10.1109/tmag.2013.2290510
https://doi.org/10.1109/tmag.2013.2290510
Autor:
Jeffrey S. Pulskamp, Sarah S. Bedair, Charles R. Dietlein, Ronald G. Polcawich, Christopher D. Meyer
Publikováno v:
IEEE Microwave and Wireless Components Letters. 25:163-165
This letter reports the design, fabrication, and performance of millimeter-wave transmission lines and devices in a tri-layer thick-copper (Cu) process. Beneath the Cu layers is a low-voltage lead zirconium titanate (PZT) MEMS stackup atop a nitride
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fa6a95ef97b633e8d5aa2692b7bc1e9d
https://doi.org/10.1109/lmwc.2015.2391993
https://doi.org/10.1109/lmwc.2015.2391993
Autor:
Christopher D. Meyer, Sarah S. Bedair, Derek Heeger, Andrew Stillwell, Robert C. N. Pilawa-Podgurski
Publikováno v:
2016 IEEE Energy Conversion Congress and Exposition (ECCE).
Hybrid and resonant switched-capacitor (SC) converters have the potential to achieve higher power densities than conventional dc-dc converters. This work presents an interleaved, 20 V to 120 V, resonant SC converter which could be used in application
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::445cf7fe6c38faf33cbca0cbccb6a56b
https://doi.org/10.1109/ecce.2016.7854854
https://doi.org/10.1109/ecce.2016.7854854
Publikováno v:
IEEE Transactions on Magnetics. 48:4436-4439
This paper presents the fabrication and characterization of air-core power inductors that leverage vertically-stacked, thick copper spiral windings to deliver high inductance densities >; 100 nH/mm2 and quality factors >; 10 on silicon substrates. Th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b343b1940613d08403330e04e9e1ff65
https://doi.org/10.1109/tmag.2012.2197185
https://doi.org/10.1109/tmag.2012.2197185
Autor:
Tony Ivanov, Sarah S. Bedair, Scott M. Trocchia, Manrico A. Mirabelli, William Benard, Christopher D. Meyer, Lauren Boteler
Publikováno v:
ECS Transactions. 45:163-169
This work presents a strategy to enable heterogeneous integration by using electroplated copper as an embedding material to mechanically secure disparate electronic chips within a silicon template wafer. Manual placement of chips into template socket
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::75a14e174e2fd5fad66c04244114a1e1
https://doi.org/10.1149/1.3700949
https://doi.org/10.1149/1.3700949
Autor:
Robert M. Proie, Ronald G. Polcawich, Ryan Q. Rudy, Sarah S. Bedair, Jeffrey S. Pulskamp, Tony Ivanov, Gabriel L. Smith, Christopher D. Meyer, William D. Nothwang, Luz M. Sanchez, Daniel M. Potrepka
Publikováno v:
Journal of the American Ceramic Society. 95:1777-1792
This review article presents recent advancements in the design and fabrication of thin-film (
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::949e82b1ca64775932eea216f672d081
https://doi.org/10.1111/j.1551-2916.2012.05155.x
https://doi.org/10.1111/j.1551-2916.2012.05155.x