Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Christina Modes"'
Publikováno v:
Active and Passive Electronic Components, Vol 25, Iss 2, Pp 141-145 (2002)
Rapid growth in the application of LTCC technology for RF wireless is clearly driven by the trend of miniaturization and mobile communication systems. This technology provides the possibility of integration of passive components in a cost effective w
Externí odkaz:
https://doaj.org/article/226791b24a61429f91ebeb6a222a587b
Autor:
Jessica Reitz, Ilias Nikolaidis, Anton Miric, Melanie Bawohl, Gabriel Zier, Mark Challingsworth, Kai Herbst, Christina Modes, Paul Gundel
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2016:000073-000078
So far Direct Bonded Copper (DBC) substrates have been the standard for power electronics. They provide excellent electrical and thermal conductivity at low cost. Weaknesses of DBC technology are the inevitable warpage and the relatively low reliabil
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0329da87e906ab4ee7a59e875efbdd8a
https://doi.org/10.4071/2016cicmt-tp2b2
https://doi.org/10.4071/2016cicmt-tp2b2
Autor:
Melanie Bawohl, Sarah Groman, Christina Modes, Jochen Langer, Virginia C. Garcia, Mark Challingsworth, Jessica Reitz, Anja Eisert
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2013:000155-000161
Electronic circuits made by thick film technology are commonly used today in electronic circuitry for automotive applications. Densely packed multi-layer hybrid circuits are very well established for motor and transmission management in standard gaso
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::28e3eeec2f457ad88fa008065e0efdf4
https://doi.org/10.4071/cicmt-wp24
https://doi.org/10.4071/cicmt-wp24
Autor:
Torsten Nowak, Melanie Bawohl, Caitlin Shahbazi, Jessica Reitz, Ilias Nikolaidis, Ryan Persons, Mark Challingsworth, Christoph Czwickla, Christina Modes, Paul Gundel, Virginia C. Garcia
Publikováno v:
2016 IEEE Applied Power Electronics Conference and Exposition (APEC).
This paper presents Thick Printed Copper (TPC) as substrate technology for High Brightness LEDs, which features a strongly improved reliability combined with a significant cost advantage over incumbent technologies for High Brightness LED substrates.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1b53168939329e91f910caadeb9e238d
https://doi.org/10.1109/apec.2016.7468301
https://doi.org/10.1109/apec.2016.7468301
Publikováno v:
International Journal of Applied Ceramic Technology. 4:53-59
Low-temperature co-fired ceramics (LTCC) is a powerful technology for the manufacture of integrated electronic devices. To fulfill the needs of miniaturization, the applied materials must be of constant quality and the manufacturing processes must be
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ed433f7c822e942f1e13164e2e346610
https://doi.org/10.1111/j.1744-7402.2007.02119.x
https://doi.org/10.1111/j.1744-7402.2007.02119.x
Publikováno v:
International Journal of Applied Ceramic Technology. 2:374-382
Low shrinkage in x and y direction and low tolerances of shrinkage are an indispensable precondition for high-density component configuration. Therefore, zero shrinkage sintering technologies as pressure-assisted sintering and sacrificial tapes have
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3c6e5362d2baeda0955c07fa544aefe8
https://doi.org/10.1111/j.1744-7402.2005.02038.x
https://doi.org/10.1111/j.1744-7402.2005.02038.x
Publikováno v:
Active and Passive Electronic Components, Vol 25, Iss 2, Pp 141-145 (2002)
Rapid growth in the application of LTCC technology for RF wireless is clearly driven by the trend of miniaturization and mobile communication systems. This technology provides the possibility of integration of passive components in a cost effective w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::4f42575a9e5fcda7523c306a2c43e647
https://doi.org/10.1080/08827510212346
https://doi.org/10.1080/08827510212346
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