Zobrazeno 1 - 10
of 371
pro vyhledávání: '"Christian Koos"'
Autor:
Aleksandar Nesic, Matthias Blaicher, Pablo Marin-Palomo, Christoph Füllner, Sebastian Randel, Wolfgang Freude, Christian Koos
Publikováno v:
Light: Advanced Manufacturing, Vol 4, Iss 3, Pp 251-262 (2023)
Multi-photon lithography has emerged as a powerful tool for photonic integration, allowing to complement planar photonic circuits by 3D-printed freeform structures such as waveguides or micro-optical elements. These structures can be fabricated with
Externí odkaz:
https://doaj.org/article/dfde18d7ccb64d12b75dac514c965e90
Autor:
Luca Valenziano, Joachim Hebeler, Alban Sherifaj, Fabian Thome, Christian Koos, Thomas Zwick, Akanksha Bhutani
Publikováno v:
Electronics Letters, Vol 60, Iss 6, Pp n/a-n/a (2024)
Abstract This letter presents the design, fabrication and measurement of a 72 kHz to 113 GHz ultra‐broadband amplifier that includes a direct current (DC)‐blocking functionality. This amplifier module stands out with a high average gain of 12.5 d
Externí odkaz:
https://doaj.org/article/58b312fd1d414f2a80fb969f66ce2332
Autor:
Yilin Xu, Pascal Maier, Mareike Trappen, Philipp-Immanuel Dietrich, Matthias Blaicher, Rokas Jutas, Achim Weber, Torben Kind, Colin Dankwart, Jens Stephan, Andreas Steffan, Amin Abbasi, Padraic Morrissey, Kamil Gradkowski, Brian Kelly, Peter O’Brien, Wolfgang Freude, Christian Koos
Publikováno v:
Light: Advanced Manufacturing, Vol 4, Iss 2, Pp 77-93 (2023)
Wafer-level mass production of photonic integrated circuits (PIC) has become a technological mainstay in the field of optics and photonics, enabling many novel and disrupting a wide range of existing applications. However, scalable photonic packaging
Externí odkaz:
https://doaj.org/article/91c6d27f50564463a78165322edfcde4
Autor:
Philipp Trocha, Juned Nassir Kemal, Quentin Gaimard, Guy Aubin, François Lelarge, Abderrahim Ramdane, Wolfgang Freude, Sebastian Randel, Christian Koos
Publikováno v:
Scientific Reports, Vol 12, Iss 1, Pp 1-12 (2022)
Abstract Laser-based light detection and ranging (LiDAR) is key to many applications in science and industry. For many use cases, compactness and power efficiency are key, especially in high-volume applications such as industrial sensing, navigation
Externí odkaz:
https://doaj.org/article/1ec94b7d002f4e5fb2af4b06d0fe7434
Autor:
Yilin Xu, Pascal Maier, Matthias Blaicher, Philipp-Immanuel Dietrich, Pablo Marin-Palomo, Wladislaw Hartmann, Yiyang Bao, Huanfa Peng, Muhammad Rodlin Billah, Stefan Singer, Ute Troppenz, Martin Moehrle, Sebastian Randel, Wolfgang Freude, Christian Koos
Publikováno v:
Scientific Reports, Vol 11, Iss 1, Pp 1-10 (2021)
Abstract Combining semiconductor optical amplifiers (SOA) on direct-bandgap III–V substrates with low-loss silicon or silicon-nitride photonic integrated circuits (PIC) has been key to chip-scale external-cavity lasers (ECL) that offer wideband tun
Externí odkaz:
https://doaj.org/article/d0dd495207b541ac8042fb8b51c49fcc
Autor:
Daria Kohler, Gregor Schindler, Lothar Hahn, Johannes Milvich, Andreas Hofmann, Kerstin Länge, Wolfgang Freude, Christian Koos
Publikováno v:
Light: Science & Applications, Vol 10, Iss 1, Pp 1-12 (2021)
Optical biosensors: light source integration Optical sensors that comprise integrated lasers and that are compatible with cost-efficient mass manufacturing could be promising for point-of-care diagnostics. Daria Kohler and coworkers at Karlsruhe Inst
Externí odkaz:
https://doaj.org/article/899c04f478544ceaaf5ee5d6ff772899
Autor:
Andrea Zazzi, Juliana Muller, Maxim Weizel, Jonas Koch, Dengyang Fang, Alvaro Moscoso-Martir, Ali Tabatabaei Mashayekh, Arka D. Das, Daniel Drays, Florian Merget, Franz X. Kartner, Stephan Pachnicke, Christian Koos, J. Christoph Scheytt, Jeremy Witzens
Publikováno v:
IEEE Open Journal of the Solid-State Circuits Society, Vol 1, Pp 209-221 (2021)
Electrical-optical signal processing has been shown to be a promising path to overcome the limitations of state-of-the-art all-electrical data converters. In addition to ultra-broadband signal processing, it allows leveraging ultra-low jitter mode-lo
Externí odkaz:
https://doaj.org/article/e2cc858df9364b0c87598149c9a57bba
Autor:
Dietmar Korn, Matthias Lauermann, Sebastian Koeber, Patrick Appel, Luca Alloatti, Robert Palmer, Pieter Dumon, Wolfgang Freude, Juerg Leuthold, Christian Koos
Publikováno v:
Nature Communications, Vol 7, Iss 1, Pp 1-9 (2016)
On-chip light sources for silicon photonic circuits remain a challenge since the indirect bandgap of silicon prevents efficient light emission. The authors demonstrate that lasing can be achieved by combining standard silicon-on-insulator waveguides
Externí odkaz:
https://doaj.org/article/5048628066d44719becb1071f78ac221
Autor:
Anna Zakhurdaeva, Philipp-Immanuel Dietrich, Hendrik Hölscher, Christian Koos, Jan G. Korvink, Swati Sharma
Publikováno v:
Micromachines, Vol 8, Iss 9, p 285 (2017)
Glassy carbon is a graphenic form of elemental carbon obtained from pyrolysis of carbon-rich precursor polymers that can be patterned using various lithographic techniques. It is electrically and thermally conductive, mechanically strong, light, corr
Externí odkaz:
https://doaj.org/article/00f7aa7dd7d941efa8f254da54482f69
Autor:
Ivan-Lazar Bundalo, Padraic E. Morrissey, Andrea Annoni, Roel Baets, Fabrice Blache, Laurens Breyne, Lee Carrol, Sean Collins, Philipp-Immanuel Dietrich, Leos Halmo, Filipe Jorge, Mikko Karppinen, Mikko Kaunisto, Brian Kelly, Joris Van Kerrebrouck, Christian Koos, Markku Lahti, Joris Lambrecht, Tienforti Marcello, Junsu Su Lee, Jeroen Missinne, Peter Ossieur, Roberto Pessina, Tom Sterken, Geert Van Steenberge, Antonello Vannucci, Alessandro Vannucchi, Rik Verplancke, Pieter Wuytens, Yilin Xu, Martin Zoldak, Peter OaBrien
Publikováno v:
IEEE Journal of Selected Topics in Quantum Electronics, 28 (3), Art.Nr. 8300311
IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS
Bundalo, I L, Morrissey, P E, Annoni, A, Baets, R, Blache, F, Breyne, L, Carroll, L, Collins, S, Dietrich, P I, Halmo, L, Jorge, F, Karppinen, M, Kaunisto, M, Kelly, B, Vankerrebrouck, J, Koos, C, Lahti, M, Lambrecht, J, Tienforti, M, Lee, J S, Missinne, J, Ossieur, P, Pessina, R, Sterken, T, Van Steenberge, G, Vannucci, A, Vannucchi, A, Verplancke, R, Wuytens, P, Xu, Y, Zoldak, M & O'brien, P 2022, ' PIXAPP Photonics Packaging Pilot Line development of a silicon photonic optical transceiver with pluggable fiber connectivity ', IEEE Journal of Selected Topics in Quantum Electronics, vol. 28, no. 3, 8300311 . https://doi.org/10.1109/JSTQE.2022.3158891
IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS
Bundalo, I L, Morrissey, P E, Annoni, A, Baets, R, Blache, F, Breyne, L, Carroll, L, Collins, S, Dietrich, P I, Halmo, L, Jorge, F, Karppinen, M, Kaunisto, M, Kelly, B, Vankerrebrouck, J, Koos, C, Lahti, M, Lambrecht, J, Tienforti, M, Lee, J S, Missinne, J, Ossieur, P, Pessina, R, Sterken, T, Van Steenberge, G, Vannucci, A, Vannucchi, A, Verplancke, R, Wuytens, P, Xu, Y, Zoldak, M & O'brien, P 2022, ' PIXAPP Photonics Packaging Pilot Line development of a silicon photonic optical transceiver with pluggable fiber connectivity ', IEEE Journal of Selected Topics in Quantum Electronics, vol. 28, no. 3, 8300311 . https://doi.org/10.1109/JSTQE.2022.3158891
This paper demonstrates how the PIXAPP Photonics Packaging Pilot Line uses its extensive packaging capabilities across its European partner network to design and assemble a highly integrated silicon photonic-based optical transceiver. The processes u
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0b8109b162a5d76232f9649a10f7e06a
https://doi.org/10.1109/jstqe.2022.3158891
https://doi.org/10.1109/jstqe.2022.3158891