Zobrazeno 1 - 10
of 12
pro vyhledávání: '"Christian Goth"'
Publikováno v:
Micromachines, Vol 13, Iss 12, p 2243 (2022)
In-process monitoring of weld penetration depth is possible with optical coherence tomography (OCT). The weld depth can be identified with OCT by statistical signal processing of the raw OCT signal and keyhole mapping. This approach is only applicabl
Externí odkaz:
https://doaj.org/article/de6f0573e2b846a9b9fe5bc8de47fd79
Autor:
Thomas Will, Johannes Müller, Ricus Müller, Claudio Hölbling, Christian Goth, Michael Schmidt
Publikováno v:
The International Journal of Advanced Manufacturing Technology. 125:1955-1963
Laser welding of copper hairpins is required to produce a conductive connection in electric stators. Past manufacturing processes introduce misalignments that lead to poor weld connections with increased electrical resistance. In this work, we discus
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::feb688e349018a4244f8426dd4820f92
https://doi.org/10.1007/s00170-022-10796-x
https://doi.org/10.1007/s00170-022-10796-x
Autor:
Bettina Ottinger, Joshua Holverscheid, Sebastian Konig, Edgar Jerichow, Sebastian Lunz, Mario Sprenger, Lars Muller, Christian Goth, Jorg Franke
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::365534e571ad34112a33dfcf17441c99
https://doi.org/10.1109/eptc56328.2022.10013246
https://doi.org/10.1109/eptc56328.2022.10013246
Publikováno v:
Advanced Materials Research. 1038:115-120
The adhesion test of metallic structures on MID (Molded Interconnect Devices) parts is an unsolved issue. So far no method really works reliably. The test methods which are conventionally used are the pull-off test and the shear-test. Both show large
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c69262f7586695ad7a6c4a91b68a8579
https://doi.org/10.4028/www.scientific.net/amr.1038.115
https://doi.org/10.4028/www.scientific.net/amr.1038.115
Publikováno v:
International Symposium on Microelectronics. 2012:000741-000748
To meet the growing demand for adapted 3D electronic devices, e. g. for customized electronic components as well as for Molded Interconnect Devices in small batches, 3D aerosol-jet printing combined with widely-used rapid prototyping methods like ste
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::099858cc62466809bada032f74ac5233
https://doi.org/10.4071/isom-2012-wa65
https://doi.org/10.4071/isom-2012-wa65
Publikováno v:
Zeitschrift für wirtschaftlichen Fabrikbetrieb. 104:925-930
Kurzfassung Die Technologie räumlicher elektronischer Schaltungsträger (Molded Interconnect Devices – MID) bietet mit der hohen Gestaltungsfreiheit, Umweltverträglichkeit sowie dem umfangreichen Rationalisierungspotenzial vielfältige Möglichke
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5357a5c70bf9637a0d1371f84465bb7d
https://doi.org/10.3139/104.110184
https://doi.org/10.3139/104.110184
Publikováno v:
2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Because of the growing use in peripheral applications, the climatic, mechanical and chemical stress on electronic devices is increasing. Consequently, appropriate protection mechanisms have to be developed and evaluated. Focus of this research work a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bb07375a41a72274307bc5ad13280bd6
https://doi.org/10.1109/impact.2012.6420229
https://doi.org/10.1109/impact.2012.6420229
Autor:
M. Schober, Christian Goth, Bertram Schmidt, Andreas Reinhardt, H. Kuck, Jörg Franke, Sören Majcherek, A. Brose
Publikováno v:
2012 4th Electronic System-Integration Technology Conference.
In this paper, research activities on the reliability for bare die connections on molded interconnected devices (MID) and flexible substrates are presented. The results were achieved by experimental, thermo-mechanical stress characterization combined
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::76d4e23384035a055f37faf21dcbf4d6
https://doi.org/10.1109/estc.2012.6542104
https://doi.org/10.1109/estc.2012.6542104
Publikováno v:
2011 IEEE International Symposium on Assembly and Manufacturing (ISAM).
Three-dimensional circuit carriers offer an enormous potential to enhance the functionality and simultaneously miniaturize the overall size of electronic systems. These Molded Interconnect Devices (3D-MID) are manufactured by injection molding and st
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::99dc567df57e4a30b246bb6ab4b01943
https://doi.org/10.1109/isam.2011.5942362
https://doi.org/10.1109/isam.2011.5942362
Publikováno v:
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
Printing technologies allow the production of fine pitch electronic applications supporting further miniaturization of mechatronic systems. Aerosol Jet® is an innovative non-contact and maskless printing process for fine structures below 50 μm with
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::81f7275b908e49804a4f04ad740982c8
https://doi.org/10.1109/ectc.2011.5898664
https://doi.org/10.1109/ectc.2011.5898664