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Autor:
Papa Momar Souare, Laurent Le Pailleur, Denis Dutoit, Francois de Crecy, Cristiano Santos, Pascal Vivet, Sylvain Dumas, Vincent Fiori, Didier Lattard, Haykel Ben-Jamaa, Perceval Coudrain, Severine Cheramy, R. Prieto, Christian Chancel, Jean-Philippe Colonna, Alexis Farcy
Publikováno v:
IEEE Design & Test. 33:21-36
This article describes heat dissipation challenges in 3-D ICs; using two case studies, it also presents insights and design guidelines for 3-D thermal management.