Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Christian, Fechtelpeter"'
Publikováno v:
2022 IEEE 28th International Conference on Engineering, Technology and Innovation (ICE/ITMC) & 31st International Association For Management of Technology (IAMOT) Joint Conference.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6d11c2b3416323b0b38416689e40d333
https://doi.org/10.1109/ice/itmc-iamot55089.2022.10033146
https://doi.org/10.1109/ice/itmc-iamot55089.2022.10033146
Autor:
Christian, Fechtelpeter
Die Digitalisierung eröffnet mittelständischen Unternehmen vielfältige Innovationspotentiale. Zugleich sind die hohe Dynamik des Wandels und die Technologievielfalt zentrale Herausforderungen. Als Lösungsansatz zeichnet sich der Technologietransf
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::2e0230b0c580699130f036c68151b77a
https://digital.ub.uni-paderborn.de/doi/10.17619/UNIPB/1-1635
https://digital.ub.uni-paderborn.de/doi/10.17619/UNIPB/1-1635
Publikováno v:
Gestaltung digitalisierter Arbeitswelten ISBN: 9783662580134
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::08e3dd8042c7c0082e229741bc1b5772
https://doi.org/10.1007/978-3-662-58014-1_3
https://doi.org/10.1007/978-3-662-58014-1_3
Publikováno v:
The Journal of Technology Transfer.
One of the main challenges in technology transfer is to actively involve small and medium-sized enterprises (SMEs)—which are most in need of and benefit the most from collaborative Research and Development (R&D) programs. This study presents a larg
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::773b61813ff368e20e6c8e7f08d52d05
https://doi.org/10.1007/s10961-021-09913-x
https://doi.org/10.1007/s10961-021-09913-x
Publikováno v:
Procedia Technology. 26:324-332
Molded Interconnect Devices (MID) are three-dimensional structures with integrated electronic circuit traces that facilitate the miniaturization and functional integration of technical products. This opens up new possibilities for the conception and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::fbd28bacad893c158764c3c8dd65ee40
Publikováno v:
Advanced Materials Research. 1038:19-27
The MID technology offers a high potential for the development of innovative integrated product solutions. The integration of mechanical and electronic functions on a spatial circuit board allows the realization of modules with a high functional dens
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ef6e7490063756a9a4247350d98ca682
https://doi.org/10.4028/www.scientific.net/amr.1038.19
https://doi.org/10.4028/www.scientific.net/amr.1038.19
Autor:
Hagen Muller, André Zimmermann, Christian Fechtelpeter, Karl-Peter Fritz, Christoph Jürgenhake, Paul Wild, Thomas Mager, Roman Dumitrescu, Tobias Grözinger
Publikováno v:
2016 12th International Congress Molded Interconnect Devices (MID).
The MID technology is used in more and more industrial applications. There are strong interactions between the materials used and the manufacturing process, which can have a direct influence of the quality and reliability of the final product. Hence,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a14cc7ccf44ae104dd64495ba95d80be
https://doi.org/10.1109/icmid.2016.7738934
https://doi.org/10.1109/icmid.2016.7738934
Publikováno v:
Tag des Systems Engineering ISBN: 9783446443570
Tag des Systems Engineering: Bremen, 12.–14. November 2014
Tag des Systems Engineering: Bremen, 12.–14. November 2014
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ab16ed0c9353815a4b8a1e8c341c8e04
https://doi.org/10.3139/9783446443761.003
https://doi.org/10.3139/9783446443761.003