Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Christel Drijbooms"'
Autor:
S. Paolillo, Guillaume Boccardi, N. Jourdan, Manoj Jaysankar, Zheng Tao, Sylvain Baudot, Geert Mannaert, Juergen Boemmels, T. Hopf, E. Capogreco, Shouhua Wang, Efrain Altamirano, E. Dupuy, Olalla Varela Pedreira, B. Briggs, Thomas Chiarella, Joris Cousserier, Sofie Mertens, Romain Ritzenthaler, Frank Holsteyns, C. Lorant, Goutham Arutchelvan, Ingrid Demonie, Steven Demuynck, K. Kenis, Xiuju Zhou, Anshul Gupta, F. Sebai, D. Radisic, Zsolt Tokei, Erik Rosseel, A. Sepulveda, Naoto Horiguchi, Christel Drijbooms, Antony Premkumar Peter, Haroen Debruyn, Nouredine Rassoul, Bilal Chehab, P. Morin, Boon Teik Chan, Christopher J. Wilson, Katia Devriendt, Noemie Bontemps, Frederic Lazzarino, Paola Favia, Lieve Teugels, D. Yakimets, F. Schleicher, Houman Zahedmanesh, Jerome Mitard, Min-Soo Kim, An De Keersgieter, Sujith Subramanian, Kevin Vandersmissen, Hans Mertens, Eugenio Dentoni Litta, Yong Kong Siew
Publikováno v:
IEEE Transactions on Electron Devices. 67:5349-5354
Buried power rail (BPR) is a key scaling booster for CMOS extension beyond the 5-nm node. This work demonstrates, for the first time, the integration of tungsten (W) BPR lines with Si finFETs. BPR technology requires insertion of metal in the front-e
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::39c090ddf1ac756f7a1d162529a99308
https://doi.org/10.1109/ted.2020.3033510
https://doi.org/10.1109/ted.2020.3033510
Publikováno v:
ECS Meeting Abstracts. :1949-1949
We have explored the possibility to fabricate Cu interconnects for 3D Stacked-Integrated-Circuit (3D-SIC) applications using electrochemical deposition from the Cu bath with model organic additives. The Cu bath used was a two-component bath, with bis
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c43727e535a7f05caf6b6b2688c63766
https://doi.org/10.1149/ma2011-02/28/1949
https://doi.org/10.1149/ma2011-02/28/1949
Autor:
Mia Honore, Hugo Bender, Nancy Heylen, Yu-Shuen Wang, Christel Drijbooms, Zaid El-Mekki, Annemie Van Ammel, Kris Vanstreels, Wouter Ruythooren, Silvia Armini, Kevin Vandersmissen, Simon Rodet, Harold Philipsen, Aleksandar Radisic
Publikováno v:
ECS Meeting Abstracts. :1991-1991
In the work presented here, we focused on fabrication of Cu nails for 3D Stacked-Integrated-Circuits (3D-SIC) applications using electrochemical deposition from the bath with model ('open source') additives. We have studied the effects of bath compos
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::47c58c70dd3bc78267c2ede1cb262f7b
https://doi.org/10.1149/ma2010-02/32/1991
https://doi.org/10.1149/ma2010-02/32/1991
Autor:
Ted Ko, Aleksandar Radisic, Silvia Armini, Philippe M. Vereecken, Christel Drijbooms, Hugo Bender, Sey-Ping Sun, Clement Wann, C. H. Yu, Peter Leunissen, Wouter Ruythooren, Serge Vanhaelemeersch
Publikováno v:
ECS Meeting Abstracts. :2179-2179
not Available.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::44e6a1cf05292b7e42dfe606f37774aa
https://doi.org/10.1149/ma2009-02/26/2179
https://doi.org/10.1149/ma2009-02/26/2179