Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Chris Pawlowicz"'
Publikováno v:
International Symposium for Testing and Failure Analysis.
Modern reverse engineering (RE) workflows involve a growing number of challenges as process nodes drop below 5 nm. As more circuitry is packed into smaller areas, larger quantities of raw data must be collected and processed to help reconstruct the u
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7655674a4a0a851a6df023a56b4579a2
https://doi.org/10.31399/asm.cp.istfa2021p0163
https://doi.org/10.31399/asm.cp.istfa2021p0163
Autor:
Amin Morteza Najarian, Neerushana Jehanathan, Kai Cui, Richard L. McCreery, Misa Hayashida, Chris Pawlowicz, Masahiro Kawasaki, Yuji Konyuba, Sohei Motoki, Marek Malac
We report, for the first time, the three dimensional reconstruction (3D) of a transistor from a microprocessor chip and roughness of molecular electronic junction obtained by electron tomography with Hole Free Phase Plate (HFPP) imaging. The HFPP app
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c58f482fae59b12740057e82fd21f58b
https://nrc-publications.canada.ca/eng/view/object/?id=470fa7e1-607b-48ee-bc92-a7ddd422ffc6
https://nrc-publications.canada.ca/eng/view/object/?id=470fa7e1-607b-48ee-bc92-a7ddd422ffc6
Publikováno v:
CCECE
One of the most important steps in the extraction of layout for reverse engineering of the integrated circuits (ICs) is the image segmentation of wires and vias from scan electron microscope (SEM) images. This segmentation is challenging due to the g
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6bf3844a52a7ba43cef31f0500fb33df
https://doi.org/10.1109/ccece.2018.8447878
https://doi.org/10.1109/ccece.2018.8447878
Publikováno v:
International Symposium for Testing and Failure Analysis.
Competitive circuit analysis of Integrated Circuits (ICs) is one of the most challenging types of analysis. It involves multiple complex IC die de-processing/de-layering steps while keeping precise planarity from metal layer to metal layer. Each step
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::773e4e2813b1108ebf38ef4ecfca5de7
https://doi.org/10.31399/asm.cp.istfa2015p0092
https://doi.org/10.31399/asm.cp.istfa2015p0092
Publikováno v:
Microscopy and Microanalysis. 21:1609-1610
As semiconductor industries have implemented three dimensional (3-D) structures in order to improve device performance, i.e., to decrease power requirement and to lower current leakage, a conventional 2-D TEM cross-section is no longer sufficient to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::676a54bc28c287b839e097d84e2a98ec
https://doi.org/10.1017/s143192761500882x
https://doi.org/10.1017/s143192761500882x
Autor:
Vlad Temchenko, Kevin Hewitt, Kim Kirkwood, Yahong Y.H. Qian, Chris Pawlowicz, Andrew Woodard, Christina Elliott, Tedeusz Bryskiewicz
Publikováno v:
Applications of Photonic Technology 6.
We report a non-destructive in-line monitoring method developed for Cd diffusion into InP on SACM-APD structure. Photocurrent vs voltage measurement are taken directly via proving diffused diodes on a wafer. We demonstrate that there is linear correl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::50259d23c8aa610b8352325612739ee9
https://doi.org/10.1117/12.543541
https://doi.org/10.1117/12.543541
Publikováno v:
Applied Optics. 40:930
The optical processes involved in laser trapping and optical manipulation are explored theoretically and experimentally as a means of activating a micrometer-size gear structure. We modeled the structure by using an enhanced ray-optics technique, and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::90b259c312656db7b37d739a2b03c4dc
https://doi.org/10.1364/ao.40.000930
https://doi.org/10.1364/ao.40.000930