Zobrazeno 1 - 1
of 1
pro vyhledávání: '"Chrandeep Singh"'
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
In this work, a study of different substrate models on package warpage is performed. Three different substrate models are built: First, the package substrate is simplified and modeled as one effective layer. Second, a three-layer model is proposed wi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::017cd60dc986670dc381d8391083f999
https://doi.org/10.1109/ectc.2019.00175
https://doi.org/10.1109/ectc.2019.00175
