System Reliability Worth Assessment Using the Customer Survey Approach.

Autor: Chowdhury, Au Asraf¹ achowdhury@caiso.com, Mielnik, T. C.¹, Lawton, L. E.², Sullivan, M. J.², Katz, A.², Koval, Don O.³ donkoval@shaw.ca

Publikováno v: IEEE Transactions on Industry Applications. Jan/Feb2009, Vol. 45 Issue 1, p317-322. 6p. 2 Black and White Photographs, 1 Diagram, 5 Charts, 1 Graph.

Tunable Electronic Structure via DNA-Templated Heteroaggregates of Two Distinct Cyanine Dyes.

Autor: Huff JS; Micron School of Materials Science & Engineering, Department of Physics, Department of Chemistry & Biochemistry, Department of Electrical & Computer Engineering, Boise State University, Boise, Idaho 83725, United States., Díaz SA; Center for Bio/Molecular Science and Engineering Code 6900, Electronics Science and Technology Division Code 6800, U.S. Naval Research Laboratory, Washington, District of Columbia 20375, United States., Barclay MS; Micron School of Materials Science & Engineering, Department of Physics, Department of Chemistry & Biochemistry, Department of Electrical & Computer Engineering, Boise State University, Boise, Idaho 83725, United States., Chowdhury AU; Micron School of Materials Science & Engineering, Department of Physics, Department of Chemistry & Biochemistry, Department of Electrical & Computer Engineering, Boise State University, Boise, Idaho 83725, United States., Chiriboga M; Center for Bio/Molecular Science and Engineering Code 6900, Electronics Science and Technology Division Code 6800, U.S. Naval Research Laboratory, Washington, District of Columbia 20375, United States.; Volgenau School of Engineering, George Mason University, Fairfax, Virginia 22030, United States., Ellis GA; Center for Bio/Molecular Science and Engineering Code 6900, Electronics Science and Technology Division Code 6800, U.S. Naval Research Laboratory, Washington, District of Columbia 20375, United States., Mathur D; Center for Bio/Molecular Science and Engineering Code 6900, Electronics Science and Technology Division Code 6800, U.S. Naval Research Laboratory, Washington, District of Columbia 20375, United States.; College of Science, George Mason University, Fairfax, Virginia 22030, United States., Patten LK; Micron School of Materials Science & Engineering, Department of Physics, Department of Chemistry & Biochemistry, Department of Electrical & Computer Engineering, Boise State University, Boise, Idaho 83725, United States., Roy SK; Micron School of Materials Science & Engineering, Department of Physics, Department of Chemistry & Biochemistry, Department of Electrical & Computer Engineering, Boise State University, Boise, Idaho 83725, United States., Sup A; Micron School of Materials Science & Engineering, Department of Physics, Department of Chemistry & Biochemistry, Department of Electrical & Computer Engineering, Boise State University, Boise, Idaho 83725, United States., Biaggne A; Micron School of Materials Science & Engineering, Department of Physics, Department of Chemistry & Biochemistry, Department of Electrical & Computer Engineering, Boise State University, Boise, Idaho 83725, United States., Rolczynski BS; Center for Bio/Molecular Science and Engineering Code 6900, Electronics Science and Technology Division Code 6800, U.S. Naval Research Laboratory, Washington, District of Columbia 20375, United States., Cunningham PD; Center for Bio/Molecular Science and Engineering Code 6900, Electronics Science and Technology Division Code 6800, U.S. Naval Research Laboratory, Washington, District of Columbia 20375, United States., Li L; Micron School of Materials Science & Engineering, Department of Physics, Department of Chemistry & Biochemistry, Department of Electrical & Computer Engineering, Boise State University, Boise, Idaho 83725, United States.; Center for Advanced Energy Studies, Idaho Falls, Idaho 83401, United States., Lee J; Micron School of Materials Science & Engineering, Department of Physics, Department of Chemistry & Biochemistry, Department of Electrical & Computer Engineering, Boise State University, Boise, Idaho 83725, United States.; Micron School of Materials Science & Engineering, Department of Physics, Department of Chemistry & Biochemistry, Department of Electrical & Computer Engineering, Boise State University, Boise, Idaho 83725, United States., Davis PH; Micron School of Materials Science & Engineering, Department of Physics, Department of Chemistry & Biochemistry, Department of Electrical & Computer Engineering, Boise State University, Boise, Idaho 83725, United States.; Center for Advanced Energy Studies, Idaho Falls, Idaho 83401, United States., Yurke B; Micron School of Materials Science & Engineering, Department of Physics, Department of Chemistry & Biochemistry, Department of Electrical & Computer Engineering, Boise State University, Boise, Idaho 83725, United States.; Micron School of Materials Science & Engineering, Department of Physics, Department of Chemistry & Biochemistry, Department of Electrical & Computer Engineering, Boise State University, Boise, Idaho 83725, United States., Knowlton WB; Micron School of Materials Science & Engineering, Department of Physics, Department of Chemistry & Biochemistry, Department of Electrical & Computer Engineering, Boise State University, Boise, Idaho 83725, United States.; Micron School of Materials Science & Engineering, Department of Physics, Department of Chemistry & Biochemistry, Department of Electrical & Computer Engineering, Boise State University, Boise, Idaho 83725, United States., Medintz IL; Center for Bio/Molecular Science and Engineering Code 6900, Electronics Science and Technology Division Code 6800, U.S. Naval Research Laboratory, Washington, District of Columbia 20375, United States., Turner DB; Micron School of Materials Science & Engineering, Department of Physics, Department of Chemistry & Biochemistry, Department of Electrical & Computer Engineering, Boise State University, Boise, Idaho 83725, United States., Melinger JS; Center for Bio/Molecular Science and Engineering Code 6900, Electronics Science and Technology Division Code 6800, U.S. Naval Research Laboratory, Washington, District of Columbia 20375, United States., Pensack RD; Micron School of Materials Science & Engineering, Department of Physics, Department of Chemistry & Biochemistry, Department of Electrical & Computer Engineering, Boise State University, Boise, Idaho 83725, United States.

Publikováno v: The journal of physical chemistry. C, Nanomaterials and interfaces [J Phys Chem C Nanomater Interfaces] 2022 Oct 13; Vol. 126 (40), pp. 17164-17175. Date of Electronic Publication: 2022 Sep 28.

Tuning between Quenching and Energy Transfer in DNA-Templated Heterodimer Aggregates.

Autor: Chowdhury AU, Díaz SA, Huff JS, Barclay MS, Chiriboga M; Volgenau School of Engineering, George Mason University, Fairfax, Virginia 22030, United States., Ellis GA, Mathur D; College of Science, George Mason University, Fairfax, Virginia 22030, United States., Patten LK, Sup A, Hallstrom N, Cunningham PD, Lee J, Davis PH, Turner DB, Yurke B, Knowlton WB, Medintz IL, Melinger JS, Pensack RD

Publikováno v: The journal of physical chemistry letters [J Phys Chem Lett] 2022 Mar 31; Vol. 13 (12), pp. 2782-2791. Date of Electronic Publication: 2022 Mar 23.

Correction: Interfacial acidity on the strontium titanate surface: a scaling paradigm and the role of the hydrogen bond.

Autor: Chapleski RC Jr; Department of Chemistry, University of Tennessee, Knoxville, TN 37996, USA. sharani.roy@utk.edu.; Chemical Sciences Division, Oak Ridge National Laboratory, Oak Ridge, TN 37831, USA., Chowdhury AU; Chemical Sciences Division, Oak Ridge National Laboratory, Oak Ridge, TN 37831, USA., Mason KR; Department of Chemistry, University of Tennessee, Knoxville, TN 37996, USA. sharani.roy@utk.edu., Sacci RL; Chemical Sciences Division, Oak Ridge National Laboratory, Oak Ridge, TN 37831, USA., Doughty B; Chemical Sciences Division, Oak Ridge National Laboratory, Oak Ridge, TN 37831, USA., Roy S; Department of Chemistry, University of Tennessee, Knoxville, TN 37996, USA. sharani.roy@utk.edu.

Publikováno v: Physical chemistry chemical physics : PCCP [Phys Chem Chem Phys] 2022 Jan 04; Vol. 24 (2), pp. 1202. Date of Electronic Publication: 2022 Jan 04.

Additive manufacturing of strong silica sand structures enabled by polyethyleneimine binder.

Autor: Gilmer DB; Chemical Sciences Division, Oak Ridge National Laboratory, Oak Ridge, TN, USA.; The Bredesen Center for Interdisciplinary Research and Graduate Education, University of Tennessee, Knoxville, TN, USA., Han L; Chemical Sciences Division, Oak Ridge National Laboratory, Oak Ridge, TN, USA., Lehmann ML; Chemical Sciences Division, Oak Ridge National Laboratory, Oak Ridge, TN, USA.; The Bredesen Center for Interdisciplinary Research and Graduate Education, University of Tennessee, Knoxville, TN, USA., Siddel DH; Manufacturing Science Division, Oak Ridge National Laboratory, Oak Ridge, TN, USA., Yang G; Chemical Sciences Division, Oak Ridge National Laboratory, Oak Ridge, TN, USA., Chowdhury AU; Chemical Sciences Division, Oak Ridge National Laboratory, Oak Ridge, TN, USA., Doughty B; Chemical Sciences Division, Oak Ridge National Laboratory, Oak Ridge, TN, USA., Elliott AM; Manufacturing Science Division, Oak Ridge National Laboratory, Oak Ridge, TN, USA. elliottam@ornl.gov., Saito T; Chemical Sciences Division, Oak Ridge National Laboratory, Oak Ridge, TN, USA. saitot@ornl.gov.

Publikováno v: Nature communications [Nat Commun] 2021 Aug 26; Vol. 12 (1), pp. 5144. Date of Electronic Publication: 2021 Aug 26.