Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Choukri Karoui"'
Autor:
Rao Tummala, Srikrishna Sitaraman, Junki Min, Bruce C. Chou, Christian Nopper, Motoshi Ono, Yoichiro Sato, Franck Dosseul, Madhavan Swaminathan, Venky Sundaram, Vijay Sukumaran, Choukri Karoui
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
This paper demonstrates ultra-miniaturized RF passive components integrated on thin glass substrate with small Through Package Vias (TPVs) to realize 3D Integrated Passive and Actives Component (IPAC) concept. Miniaturization is achieved through; a)
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0c75de71cdad08e07dcb09d2b9861e2e
https://doi.org/10.1109/ectc.2013.6575795
https://doi.org/10.1109/ectc.2013.6575795
Autor:
Qiao Chen, Vijay Sukumaran, Nitesh Kumbhat, Choukri Karoui, Kenji Kitaoka, Tapobrata Bandyopadhyay, Motoshi Ono, Yoichiro Sato, Madhavan Swaminathan, Christian Nopper, Mitsuru Watanabe, Venky Sundaram, Fuhan Liu, R.V. Pucha, Rao Tummala, Yuya Suzuki
Publikováno v:
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
This paper demonstrates thin glass interposers with fine pitch through package vias (TPV) as a low cost and high I/O substrate for 3D integration. Interposers for packaging of ULK and 3D-ICs need to support large numbers of die to die interconnection
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::063ddf3f70164ec23054ddebc6fefcfa
https://doi.org/10.1109/ectc.2011.5898571
https://doi.org/10.1109/ectc.2011.5898571