Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Chor Shu Cheng"'
Autor:
Lothar Lehmann, Lawrence Selvaraj, Marcel Wieland, Lulu Peng, Zishan Ali, Chor Shu Cheng, Yong Chau Ng, Patrick Rohlfs
Publikováno v:
2021 33rd International Symposium on Power Semiconductor Devices and ICs (ISPSD).
In this paper we present ultra-low loss magnetic inductors integrate-able in the far BEOL across technology nodes for power management applications such as DC-DC convertors. Our inductors have inductance densities as high as 158 nH/mm2 up to 100 MHz,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5ca693f0f58237bb828a9a21e297a591
https://doi.org/10.23919/ispsd50666.2021.9452305
https://doi.org/10.23919/ispsd50666.2021.9452305
Autor:
Lothar Lehmann, Marcel Wieland, Lawrence Selvaraj, Zishan Ali, Lulu Peng, Nur Aziz Yosokumoro, Chor Shu Cheng, Patrick Rohlfs, Yong Chau Ng
Publikováno v:
2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD).
This paper presents the development of high frequency (>10MHz) silicon-based thin-film magnetic-core inductors for DC-DC converter applications with high conversion efficiency. These inductors were fabricated with far-BEOL compatible process on 300 m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b4e2929a1e98e81a4a3c268b8cf1984e
https://doi.org/10.1109/ispsd46842.2020.9170162
https://doi.org/10.1109/ispsd46842.2020.9170162
Autor:
Lothar Lehmann, Mahmoud Shousha, Lulu Peng, S. Lawrence Selvaraj, Chor Shu Cheng, Zishan Ali, Khaled El Shafey, Marcel Wieland, Yong Chau Ng, Nur Aziz Yosokumoro, Martin Haug, Dragan Dinulovic
Publikováno v:
2020 IEEE Applied Power Electronics Conference and Exposition (APEC).
In this paper, we are reporting the design, fabrication and characterization of on-chip solenoid inductors with novel magnetic thin-film core for high frequency DC-DC power conversion application. Our CMOS - BEOL process compatible micro-inductor fab
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::edc9d19952fcc59af460fd454533cc4f
https://doi.org/10.1109/apec39645.2020.9124544
https://doi.org/10.1109/apec39645.2020.9124544
Autor:
Ramesh Rao Nistala, Zishan Ali, Xiaoxuan Li, Xintong Zhu, Lawrence Selvaraj, Lulu Peng, Zhi Qiang Mo, Chor Shu Cheng
Publikováno v:
2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA).
In this study, soft magnetic thin films including Co-Zr-Ta (CZT) and its variant are deposited on TEOS SiO2 and polyimide to characterize the interfacial adhesion strength of the full magnetic stack using the 4-Point-Bending (4PB) technique. Variatio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9b6d6240bcdfd95f86a33c88e67e6b1e
https://doi.org/10.1109/ipfa47161.2019.8984815
https://doi.org/10.1109/ipfa47161.2019.8984815
Autor:
Zeng-Yuan Wu, Chor Shu Cheng, Tze Ho Chan, Sriram Balasubramanian, Patrick Khoo, Hari Balan, Thanh Hoa Phung
Publikováno v:
2019 Electron Devices Technology and Manufacturing Conference (EDTM).
This work reports a 55nm planar-bulk automotive grade high density (HD) 0.425 $\mu$m2 SRAM cell for use in Ultra Low power (ULP) applications. Excellent Vmin of 0.68V for 95% limited Yield (LY) has been demonstrated on 16Mb array without the use of d
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::26dea83bc2b4d94ae872afc43965f0b8
https://doi.org/10.1109/edtm.2019.8731313
https://doi.org/10.1109/edtm.2019.8731313
Autor:
Ravinder Pal Singh, Zishan Ali Syed Mohammed, Lulu Peng, Chor Shu Cheng, Don Disney, Salahuddin Raju, Chui King Jien, Lawrence Selvaraj, Serine Soh
Publikováno v:
2019 Electron Devices Technology and Manufacturing Conference (EDTM).
In this paper, novel on-chip inductors with thick copper and thick magnetic core are designed and fabricated. With improved magnetic core lamination and thicker Cu layers, these inductors have achieved a high Q factor of 21.1 at 20MHz, as well as a h
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::20712b76e159458a4c0b57e7dc4f14ba
https://doi.org/10.1109/edtm.2019.8731263
https://doi.org/10.1109/edtm.2019.8731263