Zobrazeno 1 - 5
of 5
pro vyhledávání: '"ChoongHoe Kim"'
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::419336d3898c5d25d9d65770dc8db211
https://doi.org/10.1109/ectc51906.2022.00313
https://doi.org/10.1109/ectc51906.2022.00313
Autor:
Juhoon Yoon, Dong Su Ryu, Byong Jin Kim, YoungWoo Lee, DaeByoung Kang, GyuIck Jung, Jae Ung Lee, ChoongHoe Kim, EunNaRa Cho, JinYoung Khim, Sun-Joong Kim
Publikováno v:
Journal of the Microelectronics and Packaging Society. 23:43-48
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ad0223858f52cd4bd40eb123e986b51a
https://doi.org/10.6117/kmeps.2016.23.4.043
https://doi.org/10.6117/kmeps.2016.23.4.043
Autor:
Yanggyoo Jung, Kwangmo Lim, Byoungwoo Cho, TaeHo Yoon, Yunseok Song, Min Ho Kim, DaeByoung Kang, Dongjoo Park, ChoongHoe Kim, JinYoung Khim, SeokHo Na
Publikováno v:
2017 IEEE CPMT Symposium Japan (ICSJ).
The semiconductor packaging technology trend for electronic products continues to achieve greater miniaturization and higher functionality. Thinner profile chip scale packaging (CSP), such as flip chip CSP (fcCSP), with increasing die complexities is
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c152e66a7f4dfe6e9886c58c58a408c0
https://doi.org/10.1109/icsj.2017.8240085
https://doi.org/10.1109/icsj.2017.8240085
Publikováno v:
Applied Surface Science. 270:462-466
This report shows that flexible dye-sensitized solar cell can be fabricated by a laser-detachment and press method where the TiO2 electrode typically sintered on glass source substrate is detached by a laser pulse and then is firmly adhered to the co
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fde95fa0b4eee148bbe7be67c7edc7d3
https://doi.org/10.1016/j.apsusc.2013.01.056
https://doi.org/10.1016/j.apsusc.2013.01.056
Autor:
ChoongHoe Kim, Choonheung Lee, Jin Young Kim, Yanggyoo Jung, Yunseok Song, DongSu Ryu, Minho Gim, Juhoon Yoon
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Conventional flip chip technologies such as the mass reflow (MR) process and the thermal compression bonding (TCB) process are commonly used technologies in the micro assembly field. However, there is a continuous need for next generation interconnec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::26a8b667c8bbaa76280019efe6534098
https://doi.org/10.1109/ectc.2016.76
https://doi.org/10.1109/ectc.2016.76