Zobrazeno 1 - 10
of 21
pro vyhledávání: '"Choong Peng"'
Autor:
Puntmann Valentina O, D'Cruz David, Smith Zachary, Pastor Ana, Choong Peng, Carr-White Gerald, Voigt Tobias, Sangle Shirish R, Schaeffter Tobias, Nagel Eike
Publikováno v:
Journal of Cardiovascular Magnetic Resonance, Vol 15, Iss Suppl 1, p O22 (2013)
Externí odkaz:
https://doaj.org/article/4982846277684ffcbfa754e70146f9bf
Autor:
Jean Choong Peng Lee
Publikováno v:
ESP Today - Journal of English for Specific Purposes at Tertiary Level; Jun2024, Vol. 12 Issue 2, p319-348, 30p
Autor:
Jean Choong Peng Lee
Publikováno v:
ESP Today. 11:6-30
Gaze and facial expression are non-verbal communicative modes that help presenters to reinforce their verbal messages and perform communicative functions to meet oral presentation goals. However, there are limited studies on how gaze and facial expre
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7be614db47f8194f1da8d9cbf1c2b4bb
https://doi.org/10.18485/esptoday.2023.11.1.1
https://doi.org/10.18485/esptoday.2023.11.1.1
Autor:
Choong Peng Lee, Jean
Publikováno v:
ESP Today - Journal of English for Specific Purposes at Tertiary Level; Jan2023, Vol. 11 Issue 1, p6-30, 25p
Publikováno v:
Microelectronics Reliability. 50:928-936
Through an aggressive product development program which includes experiment and simulation, Amkor has developed the next level of WLCSP (CSP nl ™), a product which exhibits superior board level reliability when subjected to drop impact, a strong re
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::df4542b739773c296c6bdabb1a4651d4
https://doi.org/10.1016/j.microrel.2010.02.027
https://doi.org/10.1016/j.microrel.2010.02.027
Autor:
Choong Peng Khoo, Tong Yan Tee, Fu Lin Liu, Zhong Chen, Kuo Tsing Tsai, Hun Shen Ng, Shu Min Lim, Vincent Chng
Publikováno v:
2009 11th Electronics Packaging Technology Conference.
Due to the widespread use of portable electronics, there is a significant increase in interest in exploring the impact reliability of electronic packaging during impact shock. Currently, the test standard used for board level drop testing is JESD 22-
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::12add9370387319633ec0afcb3ecf87c
https://doi.org/10.1109/eptc.2009.5416542
https://doi.org/10.1109/eptc.2009.5416542
Publikováno v:
EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
Through an aggressive product development program which includes experiment and simulation, Amkor has developed the next level of WLCSP (CSPnl™), a product which exhibits superior board level reliability when subjected to drop impact, a strong requ
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5c4121154f51d461f2f7d26df48fb612
https://doi.org/10.1109/esime.2009.4938518
https://doi.org/10.1109/esime.2009.4938518
Autor:
Hun Shen Ng, R. Moody, Tong Yan Tee, Long BinTan, Choong Peng Khoo, Jim Hee Low, Rex Anderson, Boyd Rogers
Publikováno v:
2008 10th Electronics Packaging Technology Conference.
The Wafer Level Chip Scale Package (WLCSP) is gaining popularity for its performance and for its ability to meet miniaturization requirements of portable consumer electronics, such as cell phones. Due to differential bending between the silicon die a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::42bd4b88f0452bedcead35c6061de45c
https://doi.org/10.1109/eptc.2008.4763574
https://doi.org/10.1109/eptc.2008.4763574
Akademický článek
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Autor:
Choong, Peng Kee
Three uncertainty analysis methods, namely : (1) Monte Carlo (MC) simulation, (2) First-Order Second Moment (FOSM) method, and (3) Modified Point Estimate (MPE) method, were compared in terms of computational efficiency and accuracy for evaluation of
Externí odkaz:
http://hdl.handle.net/10919/44280
http://scholar.lib.vt.edu/theses/available/etd-08182009-040359/
http://scholar.lib.vt.edu/theses/available/etd-08182009-040359/
