Zobrazeno 1 - 10
of 22
pro vyhledávání: '"Choon-Heung Lee"'
Publikováno v:
Journal of Microelectronic & Electronic Packaging; 2024, Vol. 21 Issue 1, p14-19, 6p
Publikováno v:
IMAPSource Proceedings. 2022
XDFOITM (X Dimension Fan Out Integration) is a package family designed for fan out packages and heterogeneous integration, as XDFOI offers great flexibility to let single die or multi-functional chips, such as logic, memory, power management, RF and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2dca6e3939361277ea2c4d16fb3c8392
https://doi.org/10.4071/001c.74581
https://doi.org/10.4071/001c.74581
Publikováno v:
Advancing Microelectronics; 2024, Vol. 51 Issue 4, p26-31, 6p
Autor:
F.F. Faheem, Jeong Tae Kim, Jae Dong Kim, Jun Su Lee, Choon Heung Lee, Jin Young Kim, Jong Dae Jung
Publikováno v:
IEEE Transactions on Advanced Packaging. 32:453-460
Cost effective microelectromechanical system (MEMS) packaging methods have been required, because the cost portion of the MEMS package is more than 80% of the manufacturing cost of a MEMS device. For this reason, cost-effective MEMS packaging is prop
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0788913369b5362062ab76ea7c46b977
https://doi.org/10.1109/tadvp.2009.2014121
https://doi.org/10.1109/tadvp.2009.2014121
Publikováno v:
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
In this paper, the FEM based various parametric studies such as packaging material and structural effects, under bump metallization and passivation structures and material property effects on the low k layer are investigated for the flip-chip packagi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dee34fe4e2701b8283a7b8e96f4f05f7
https://doi.org/10.1109/ectc.2010.5490766
https://doi.org/10.1109/ectc.2010.5490766
Autor:
Miguel Jimarez, Robert Francis Darveaux, Choon Heung Lee, Jae Yun Gim, Boo Yang Jung, Nokibul Islam, Jae Dong Kim, Min Yoo
Publikováno v:
2009 59th Electronic Components and Technology Conference.
Amkor's FCMBGA, flip chip package based on transfer molding for high performance device was developed and introduced to industry in 2008[1,2]. During the molding process, bump deformation was not significant, and voids were not observed under flip ch
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0bb93321b800c8c8657044fe938b7e6b
https://doi.org/10.1109/ectc.2009.5074031
https://doi.org/10.1109/ectc.2009.5074031
Publikováno v:
2008 58th Electronic Components and Technology Conference.
The molded underfill (MUF) process has a lot of advantages compared with capillary underfill process in view of reduction of process, cycle time of process, material and equipment cost since this application utilizes the conventional mold materials a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c4e9c6a306675c53e7a0831e9de36894
https://doi.org/10.1109/ectc.2008.4550000
https://doi.org/10.1109/ectc.2008.4550000
Publikováno v:
2007 International Conference on Electronic Materials and Packaging.
Lower cost package for microelectromechanical systems (MEMS) have been required, because the cost portion of the MEMS package is more than 30% of the cost of a MEMS product. For the reason, cost effective MEMS packaging platforms are proposed in this
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f0da5e5901e62f8efbcb9388782bb6ea
https://doi.org/10.1109/emap.2007.4510329
https://doi.org/10.1109/emap.2007.4510329
Autor:
Won Joon Kang, Tae Kyung Hwang, Chan Ha Hwang, JoonYeob Lee, Eun Sook Sohn, Se Woong Cha, Choon Heung Lee
Publikováno v:
2007 International Conference on Electronic Materials and Packaging.
In spite of a great success of stacked package (PoP) in the market, some reliability issues about package on package (PoP) have been raised by several customers. To guarantee a high reliability in board level performances, many process and material d
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6e41169408aec88282f8eb47e6736efb
https://doi.org/10.1109/emap.2007.4510333
https://doi.org/10.1109/emap.2007.4510333
Publikováno v:
56th Electronic Components and Technology Conference 2006.
According as high density packaging options such as 2 or more die stacking or package stacking technologies are developed, the major mold process related quality concerns such as incomplete mold, exposed wires and wire sweeping are increased because
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b4433ce13a69c34b008b85a4be3cb5c2
https://doi.org/10.1109/ectc.2006.1645780
https://doi.org/10.1109/ectc.2006.1645780