Zobrazeno 1 - 10
of 34
pro vyhledávání: '"Chongyang Cai"'
Autor:
Hailei Zhang, Bo Zhang, Chongyang Cai, Kaiming Zhang, Yu Wang, Yuan Wang, Yanmin Yang, Yonggang Wu, Xinwu Ba, Richard Hoogenboom
Publikováno v:
Nature Communications, Vol 15, Iss 1, Pp 1-11 (2024)
Abstract Developing X-ray scintillators that are water-dispersible, compatible with polymeric matrices, and processable to flexible substrates is an important challenge. Herein, Tb3+-doped Na5Lu9F32 is introduced as an X-ray scintillating material wi
Externí odkaz:
https://doaj.org/article/80954e4743ea474da034677682e16d71
Autor:
Leipeng Li, Tianyi Li, Yue Hu, Chongyang Cai, Yunqian Li, Xuefeng Zhang, Baolai Liang, Yanmin Yang, Jianrong Qiu
Publikováno v:
Light: Science & Applications, Vol 11, Iss 1, Pp 1-8 (2022)
Long persistent luminescence of Gd3+ is reported and a possible mechanism of the trivalent lanthanides’ persistent luminescence in wide bandgap hosts is proposed.
Externí odkaz:
https://doaj.org/article/c8f3e6d7d4364847bcb12e1df618ec40
Autor:
Chongyang Cai1, Zhi Yang1 yzhi@google.com, Yuan Li1, Jain, Padam1, Kang, Terry1, Mellachervu, Krishna2
Publikováno v:
Journal of Microelectronic & Electronic Packaging. 2023, Vol. 20 Issue 1, p9-16. 8p.
Autor:
Leipeng Li, Chongyang Cai, Xiaohuan Lv, Xingqiang Shi, Dengfeng Peng, Jianrong Qiu, Yanmin Yang
Publikováno v:
Advanced Functional Materials.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8c6cef94c9c86206bce9459a55918043
https://doi.org/10.1002/adfm.202301372
https://doi.org/10.1002/adfm.202301372
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:562-569
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::16a6b94eb850dbabeeec9f3eb754a2fc
https://doi.org/10.1109/tcpmt.2022.3153952
https://doi.org/10.1109/tcpmt.2022.3153952
Publikováno v:
Soldering & Surface Mount Technology. 34:266-276
Purpose This paper aims to provide the proper preset temperatures of the convection reflow oven when reflowing a printed circuit board (PCB) assembly with varied sizes of components simultaneously. Design/methodology/approach In this study, computati
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2d17d06fe1c9d9f306af362228db617a
https://doi.org/10.1108/ssmt-10-2021-0063
https://doi.org/10.1108/ssmt-10-2021-0063
Autor:
Yangyang Lai, Chongyang Cai, Ke Pan, Junbo Yang, Jonghwan Ha, Pengcheng Yin, Karthik Deo, Seungbae Park
Publikováno v:
ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
In this paper, an experimental approach is presented to investigate the influence of second level underfill on the thermomechanical behavior of two BGA packages during thermal cycles. Two different flip chip packages with two major underfill reinforc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::947d228668f11967847a8b7115bc6dbc
https://doi.org/10.1115/ipack2022-97349
https://doi.org/10.1115/ipack2022-97349
Autor:
Chongyang Cai, Jiefeng Xu, Yangyang Lai, Junbo Yang, Huayan Wang, Suresh Ramalingam, Gamal Refai-Ahmed, Seungbae Park
Publikováno v:
ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
With the minimization trend of component size, electromigration is becoming an increasingly important concern. Current studies mainly focused on predicting the EM time to failure (TTF) based on Black’s equation. By simulating the current and temper
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1221795769cc086f1498b01fe2b9d929
https://doi.org/10.1115/ipack2022-97338
https://doi.org/10.1115/ipack2022-97338
Publikováno v:
ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
Estimation of the thermal fatigue life of solder joints and identification of parameters that enhance the fatigue life are important steps in the development stage of BGA packages. In this study, different parameters of Sn-Ag-Cu 305 BGA (Ball Grid Ar
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::81af83dba170030cc1cf0440172760a2
https://doi.org/10.1115/ipack2022-97253
https://doi.org/10.1115/ipack2022-97253
Publikováno v:
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c757b07c1b8e55023492b184802d0a03
https://doi.org/10.1109/itherm54085.2022.9899678
https://doi.org/10.1109/itherm54085.2022.9899678