Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Chongnan Peng"'
Autor:
Chongnan Peng, Matthias Morak, Andreas Thalhamer, Mario Gschwandl, Peter Fuchs, Qi Tao, Thomas Krivec, Thomas Antretter, Miguel Angel Celigueta
Publikováno v:
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Publikováno v:
Materials Science in Semiconductor Processing. 18:46-51
Rod-like and hierarchical ZnO nanomaterials were fabricated via a single-step refluxing route in water–methanol mixed solution without any surfactant or template at low temperature. The as-prepared ZnO nanomaterials were characterized by scanning e
Autor:
Chongnan Peng, Wenhui Zhu, Fangqi Lai, Guoping Zhang, Rong Sun, S. W. Ricky Lee, Songfang Zhao
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
3D packaging using through silicon via (TSV) technology is becoming important in IC packaging industry. In this paper, the TSV process uses a polymeric liner as insulation material and a buffer for thermo-mechanical stress relaxation. Fourier transfo
Publikováno v:
2012 14th International Conference on Electronic Materials and Packaging (EMAP).
With the development of light emitting diodes (LEDs), it puts forward higher performance requirements on encapsulants, mainly epoxy resins. So far, people have made a great deal of efforts on improving the thermal conductivity, resistance of thermal
Publikováno v:
2012 13th International Conference on Electronic Packaging Technology & High Density Packaging.
With development of high-power white light LED, people pay more attention to the reliability and security of packaging materials. Epoxy resins, as a main material for LED potting compound, remains to improve its thermal conductivity and ultraviolet s