Zobrazeno 1 - 10
of 51
pro vyhledávání: '"Chong Leong Gan"'
Publikováno v:
e-Prime: Advances in Electrical Engineering, Electronics and Energy, Vol 5, Iss , Pp 100245- (2023)
This paper provides an overview of current and future deployment of recyclable direct materials and sustainable materials through recycling of interconnect metals used in semiconductor assembly and packaging. Also, with the aim to study the key techn
Externí odkaz:
https://doaj.org/article/c2b95f12cbc541e1b42796236c41f9a0
Publikováno v:
Memories - Materials, Devices, Circuits and Systems, Vol 3, Iss , Pp 100018- (2022)
In mobile market, the demand of memory packaging increase year over year. While the form factor of memory packages moves toward smaller and thinner geometry with higher pin counts, the package overall mechanical robustness becomes one of a key criter
Externí odkaz:
https://doaj.org/article/b32e7b09622248b5b05f948bf42b66d2
Autor:
Yun-Ting Hsu, Yung-Sheng Zou, Yi-Yu Chen, Min-Hua Chung, Chong-Leong Gan, Fatima Macalalad, Shriram Harihara Subramanian
Publikováno v:
2023 International Conference on Electronics Packaging (ICEP).
Publikováno v:
2023 International Conference on Electronics Packaging (ICEP).
Autor:
Chong Leong, Gan, Chen-Yu, Huang
Publikováno v:
Springer Series in Reliability Engineering ISBN: 9783031267079
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7f956baed91ddaf21d1215727986c335
https://doi.org/10.1007/978-3-031-26708-6_8
https://doi.org/10.1007/978-3-031-26708-6_8
Autor:
Chong Leong, Gan, Chen-Yu, Huang
Publikováno v:
Springer Series in Reliability Engineering ISBN: 9783031267079
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7fe35375d590465145b3b65a32360153
https://doi.org/10.1007/978-3-031-26708-6_6
https://doi.org/10.1007/978-3-031-26708-6_6
Autor:
Chong Leong, Gan, Chen-Yu, Huang
Publikováno v:
Springer Series in Reliability Engineering ISBN: 9783031267079
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::899f6505b35a0d13ea1fdea734fc11d7
https://doi.org/10.1007/978-3-031-26708-6_1
https://doi.org/10.1007/978-3-031-26708-6_1
Autor:
Chong Leong, Gan, Chen-Yu, Huang
Publikováno v:
Springer Series in Reliability Engineering ISBN: 9783031267079
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2949ce63ed7dd67f8edbc47299f8a2cc
https://doi.org/10.1007/978-3-031-26708-6_3
https://doi.org/10.1007/978-3-031-26708-6_3
Autor:
Chong Leong, Gan, Chen-Yu, Huang
Publikováno v:
Springer Series in Reliability Engineering ISBN: 9783031267079
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3e151e67531ca66b907efb6af7c451aa
https://doi.org/10.1007/978-3-031-26708-6_7
https://doi.org/10.1007/978-3-031-26708-6_7
Autor:
Chong Leong, Gan, Chen-Yu, Huang
Publikováno v:
Springer Series in Reliability Engineering ISBN: 9783031267079
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::05bcdd930898737f0caf96cf1aa75823
https://doi.org/10.1007/978-3-031-26708-6_2
https://doi.org/10.1007/978-3-031-26708-6_2