Zobrazeno 1 - 10
of 19
pro vyhledávání: '"Chong Hooi Lim"'
Autor:
Muhammad Tarique Lakhiar, Shalini Sanmargaraja, AbdulLateef Olanrewaju, Chong Hooi Lim, Vignes Ponniah, Anselm Dass Mathalamuthu
Publikováno v:
Case Studies in Thermal Engineering, Vol 60, Iss , Pp 104614- (2024)
This study examined thermal comfort in a sustainable office building in Malaysia, with the goal of understanding how objective environmental data relates to occupants' subjective experiences. The study utilized established thermal comfort models, suc
Externí odkaz:
https://doaj.org/article/537741e946ab42d89cc8300bfe735081
Publikováno v:
International Journal of Technology, Vol 13, Iss 5, Pp 1139-1148 (2022)
Lightweight and stiff lattice structures are good energy absorbers. This study evaluates the energy absorption capacity of a few common lattice structures printed out of PLA using fused deposition modeling and proposes an improved lattice struct
Externí odkaz:
https://doaj.org/article/ac8def1e6f8b48deaab1511493de1d5f
Autor:
Ishak Abdul Aziz, Chong Hooi Lim, C. Y. Khor, Mohd Sharizal Abdul Aziz, Mohd Zulkifly Abdullah
Publikováno v:
Microelectronics International. 38:182-205
Purpose This study aims to investigate the interaction of independent variables [Reynolds number (Re), thermal power and the number of ball grid array (BGA) packages] and the relation of the variables with the responses [Nusselt number ((Nu) ¯ ), de
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b355f76e025f914296fa894ad65e84cc
https://doi.org/10.1108/mi-06-2021-0049
https://doi.org/10.1108/mi-06-2021-0049
Publikováno v:
International Journal of Green Energy. 19:931-940
Nowadays, the exploitation of renewable hydropower energy sources promotes the research about water wheel as a significant source of hydropower. However, the performance characteristics of floating...
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::050961f31b584dadb9a4c3fd896fc54a
https://doi.org/10.1080/15435075.2021.1975123
https://doi.org/10.1080/15435075.2021.1975123
Autor:
Lakhiar, Muhammad Tarique, Sanmargaraja, Shalini, Olanrewaju, AbdulLateef, Chong Hooi Lim, Ponniah, Vignes, Mathalamuthu, Anselm Dass
Publikováno v:
Proceedings of the International Conference on Industrial Engineering & Operations Management; 3/6/2023, p1276-1288, 13p
Autor:
Sanmargaraja, Shalini, Olanrewaju, AbdulLateef, Tarique, Muhammad, Chong Hooi Lim, Ponniah, Vignes, Mathalamuthu, Anselm Dass
Publikováno v:
Proceedings of the International Conference on Industrial Engineering & Operations Management; 3/6/2023, p1206-1216, 11p
Autor:
Chong Hooi Lim, Pak Heng Chong, Pey Yi Toh, Yi Peng Teoh, Yee Win Tan, JitKang Lim, Sim Siong Leong
Publikováno v:
Journal of Superconductivity and Novel Magnetism. 34:2151-2165
In recent years, magnetophoresis of magnetic nanoparticles (MNPs) has been emerged as one of the most appealing separation technologies in water treatment and biomedical applications. Magnetophoresis of MNPs can be further divided into two classes: h
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::93db4941d52da84f60ce9bb93bdc90f9
https://doi.org/10.1007/s10948-021-05893-z
https://doi.org/10.1007/s10948-021-05893-z
Autor:
Mohd Zulkifly Abdullah, M. S. Abdul Aziz, Chong Hooi Lim, I. Abdul Azid, M. H. H. Ishaik, C. Y. Khor
Publikováno v:
Circuit World. 47:213-221
Purpose The purpose of this study is to investigate heat transfer and deformation of flexible printed circuit board (FPCB) under thermal and flow effects by using fluid structure interaction. This study simulate the electronic cooling process when el
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4befbeb00da7fe4228302e852343b26f
https://doi.org/10.1108/cw-02-2020-0016
https://doi.org/10.1108/cw-02-2020-0016
Publikováno v:
International Communications in Heat and Mass Transfer. 84:86-93
Flexible printed circuit board (FPCB) has started replacing rigid PCB in some electronic application. However, the deflection and heat transfer of FPCB caused by flow and thermal are far more crucial compared to rigid PCB. In the current study, effec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::580d0666af23647d9f725c01febc6d56
https://doi.org/10.1016/j.icheatmasstransfer.2017.04.004
https://doi.org/10.1016/j.icheatmasstransfer.2017.04.004
Publikováno v:
Microelectronics Reliability. 72:5-17
The desire of flexibility, compact, lightweight and low cost in current electronic device increases the application of flexible printed circuit board (FPCB). However, FPCB would encounter significant deflection and stress under operating condition (t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0c6477b9e569ec853aaca54731c8649c
https://doi.org/10.1016/j.microrel.2017.03.022
https://doi.org/10.1016/j.microrel.2017.03.022