Zobrazeno 1 - 10
of 85
pro vyhledávání: '"Chong, Ser Choong"'
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::612159f17486d04c093e7eefe60c3c72
https://doi.org/10.1109/eptc56328.2022.10013162
https://doi.org/10.1109/eptc56328.2022.10013162
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::66273678032bb5fd80b30468d194aba7
https://doi.org/10.1109/eptc56328.2022.10013188
https://doi.org/10.1109/eptc56328.2022.10013188
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a19df7c3675e8f66ed0d99173e62702b
https://doi.org/10.1109/eptc56328.2022.10013237
https://doi.org/10.1109/eptc56328.2022.10013237
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e437f082863d8798b85350c99e453fa1
https://doi.org/10.1109/eptc56328.2022.10013143
https://doi.org/10.1109/eptc56328.2022.10013143
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::03219e1d4f7e34b4319d8cbd85bfb662
https://doi.org/10.1109/ectc51906.2022.00110
https://doi.org/10.1109/ectc51906.2022.00110
Autor:
Ramanpreet Singh Pahwa, Richard Chang, Wang Jie, Xu Xun, Oo Zaw Min, Foo Chuan Sheng, Chong Ser Choong, Vempati Srinivasa Rao
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::06c2e4752ff65c40b5ae06c78d8a483b
https://doi.org/10.1109/ectc51906.2022.00297
https://doi.org/10.1109/ectc51906.2022.00297
Publikováno v:
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eac1b73f080394ec9a1e5676e9d8e55e
https://doi.org/10.1109/eptc53413.2021.9663939
https://doi.org/10.1109/eptc53413.2021.9663939
Publikováno v:
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aab15c3c1a3191251541414758f968bc
https://doi.org/10.1109/eptc53413.2021.9663883
https://doi.org/10.1109/eptc53413.2021.9663883
Autor:
Sharon Lim Pei Siang, Chong Ser Choong, Lim Teck Guan, Han Yong, Surya Bhattacharya, David Ho, Chai Tai Chong
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
High density heterogeneous integration of ASIC and HBM2 through the use of embedded fine pitch interconnect (EFI) in face-to-face configuration using RDL 1st fan-out wafer packaging platform is demonstrated. The EFI configuration, thermal design cons
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b752aaad551fa44e8aba4bbc32f99ef5
https://doi.org/10.1109/ectc32696.2021.00348
https://doi.org/10.1109/ectc32696.2021.00348
Publikováno v:
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC).
Current industry trends in the microelectronics packaging is going towards increasing in I/O density and small size packaging. Common use of solder material in packaging are the lead free solders. The popular lead free alloys include the SnAgCu (SAC)
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::87c07a044c3c6bfc8769c8010d59afee
https://doi.org/10.1109/eptc50525.2020.9315175
https://doi.org/10.1109/eptc50525.2020.9315175